Search Results - Lim, Min-Ai

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  1. 1
    Validation of the Brief Ageing Perceptions Questionnaire (B-APQ) in Malaysia

    Validation of the Brief Ageing Perceptions Questionnaire (B-APQ) in Malaysia by Jaafar, Mohamad Hasif, Villiers-Tuthill, Amanda, Sim, Su Hua, Lim, Min Ai, Morgan, Karen

    Published in Aging & mental health
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  2. 2
    The Efficacy of a Single Session of 20-Minute Mindful Breathing in Reducing Dyspnea Among Patients With Acute Decompensated Heart Failure: A Randomized Controlled Trial

    The Efficacy of a Single Session of 20-Minute Mindful Breathing in Reducing Dyspnea Among Patients With Acute Decompensated Heart Failure: A Randomized Controlled Trial by Ng, Diana Leh-Ching, Chai, Chee-Shee, Tan, Kok-Leng, Chee, Kok-Han, Tung, Yu-Zhen, Wai, Suet-Yen, Teo, Wei-Ting Joyce, Ang, Bin-Ting, Lim, Min-Ai, Tan, Seng-Beng

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  3. 3
    Validation of the Malay Version of the De Jong Gierveld Loneliness Scale

    Validation of the Malay Version of the De Jong Gierveld Loneliness Scale by Jaafar, Mohamad Hasif, Villiers‐Tuthill, Amanda, Lim, Min Ai, Ragunathan, Darshaini, Morgan, Karen

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  4. 4
    The Effect of 5-Minute Mindfulness of Peace on Suffering and Spiritual Well-Being Among Palliative Care Patients: A Randomized Controlled Study

    The Effect of 5-Minute Mindfulness of Peace on Suffering and Spiritual Well-Being Among Palliative Care Patients: A Randomized Controlled Study by Yik, Lim Liang, Ling, Look Mei, Ai, Lim Min, Ting, Ang Bin, Capelle, David Paul, Zainuddin, Sheriza Izwa, Beng, Tan Seng, Chin, Loh Ee, Loong, Lam Chee

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  5. 5
    Modeling and Simulation Technology of High Frequency Vibratory Stress Relief Treatment for Complex Thin -Walled Workpiece

    Modeling and Simulation Technology of High Frequency Vibratory Stress Relief Treatment for Complex Thin -Walled Workpiece by Zhao, Xian-yang, Zhang, Nian-song, Wang, Ai-min

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  6. 6
    The temporal trend of disease burden attributable to metabolic risk factors in China, 1990-2019: An analysis of the Global Burden of Disease study

    The temporal trend of disease burden attributable to metabolic risk factors in China, 1990-2019: An analysis of the Global Burden of Disease study by Jin, Yingzhao, So, Ho, Cerin, Ester, Barnett, Anthony, Mubarik, Sumaira, Hezam, Kamal, Feng, Xiaoqi, Wang, Ziyue, Huang, Junjie, Zhong, Chenwen, Hayat, Khezar, Wang, Fang, Wu, Ai-Min, Xu, Suowen, Zou, Zhiyong, Lim, Lee-Ling, Cai, Jiao, Song, Yimeng, Tam, Lai-Shan, Wu, Dongze

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  7. 7
    Assessment of Au Stud-Solder Interconnection for Fine Pitch Flip Chip Packaging

    Assessment of Au Stud-Solder Interconnection for Fine Pitch Flip Chip Packaging by Yeo, A., Lim, S., Tan Ai Min

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  8. 8
    Process and materials considerations for Pb-free flip chip packaging of 65nm Cu/low-k device

    Process and materials considerations for Pb-free flip chip packaging of 65nm Cu/low-k device by Tan Ai Min, Soh Choew Kheng, Sharon Pei-Siang Lim, Lee, C.

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  9. 9
    Development of solder replacement flip chip using anisotropic conductive adhesives

    Development of solder replacement flip chip using anisotropic conductive adhesives by Tan Ai Min, Lim, S.P.-S., Lee, C.

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  10. 10
    Process development of a flip chip in package with anisotropic conductive film (ACF) for lead-free soldering

    Process development of a flip chip in package with anisotropic conductive film (ACF) for lead-free soldering by Lim Pei Siang, S., Tan Ai Min, Lee, C.

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  11. 11
    Influence of bump geometry, adhesives and pad finishings on the joint resistance of Au bump and A/NCA flip chip interconnection

    Influence of bump geometry, adhesives and pad finishings on the joint resistance of Au bump and A/NCA flip chip interconnection by Tan Ai Min, Sharon Pei-Siang Lim, Yeo, A., Lee, C.

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