Showing
1 - 5
results of
5
Skip to content
VuFind
Log in
Library Catalogue Plus
Library
Subject guides
Databases
Referencing
Catalogue
Articles Plus
Keyword
Title
Author
Subject
Find
Advanced Search
Search Results - Lim, Simon Siak Boon
Search Results - Lim, Simon Siak Boon
Showing
1 - 5
results of
5
Refine Results
Sort
Relevance
Date Descending
Author
Title
1
Loading…
Demonstration of Vertically Integrated POP using FOWLP Approach
by
Chong, Ser Choong
,
Wai Leong Ching, Eva
,
Pei Siang, Sharon Lim
,
Lim Siak Boon, Simon
,
Chai, Tai Chong
Request full text
Conference Proceeding
Save to List
Saved in:
2
Loading…
Ultra-Thin FO Package-on-Package for Mobile Application
by
Hsiao, Hsiang-Yao
,
Ho, Soon Wee
,
Lim, Simon Siak Boon
,
Wai, Leong Ching
,
Chong, Ser Choong
,
Sharon Lim, Pei Siang
,
Han, Yong
,
Chai, Tai Chong
Request full text
Conference Proceeding
Save to List
Saved in:
3
Loading…
Comprehensive Study of Thermal Impact on Warpage Behaviour of FOWLP with Different Die to Mold Ratio
by
Chong, Ser Choong
,
Lim, Simon Siak Boon
,
Seit, Wen Wei
,
Chai, Tai Chong
,
Sanchez, Debbie Claire
Request full text
Conference Proceeding
Save to List
Saved in:
4
Loading…
Wafer Level Warpage Modelling and Validation for FOWLP Considering Effects of Viscoelastic Material Properties Under Process Loadings
by
Chen, Zhaohui
,
Zhang, Xiaowu
,
Lim, Sharon Pei Siang
,
Lim, Simon Siak Boon
,
Lau, Boon Long
,
Han, Yong
,
Jong, Ming Chinq
,
Liu, Songlin
,
Wang, Xiaobai
,
Andriani, Yosephine
Request full text
Conference Proceeding
Save to List
Saved in:
5
Loading…
Addressing Warpage Issue and Reliability Challenge of Fan-out Wafer-Level Packaging (FOWLP)
by
Zhang, Xiaowu
,
Lau, Boon Long
,
Han, Yong
,
Chen, Haoran
,
Jong, Ming Chinq
,
Lim, Sharon Pei Siang
,
Lim, Simon Siak Boon
,
Wang, Xiaobai
,
Andriani, Yosephine
,
Liu, Songlin
Request full text
Conference Proceeding
Save to List
Saved in:
Search Tools:
RSS Feed
Email Search
Save Search
Back
Refine Results
Page will reload when a filter is selected or excluded.
Limit To
Full Text
5 results
5
Format
Conference Proceedings
5 results
5
Subjects
Engineering
5 results
5
Engineering, Electrical & Electronic
5 results
5
Science & Technology
5 results
5
Technology
5 results
5
Electronic Components
3 results
3
Bonding
2 results
2
Dielectrics
2 results
2
Electromagnetic Compatibility
2 results
2
Fan-Out Wafer Level Package
2 results
2
Fanout
2 results
2
Fingers
2 results
2
Fowlp
2 results
2
Molding
2 results
2
Molds
2 results
2
Semiconductor Device Modeling
2 results
2
Warpage
2 results
2
Wires
2 results
2
12 Inch Mold-First
1 results
1
12 Inch Mold-First Fowlp
1 results
1
Component
1 results
1
Year of Publication
From:
To:
Source
Ieee Electronic Library (Iel) Conference Proceedings
5 results
5
Ieee Xplore All Conference Series
5 results
5