Underfill selection methodology for fine pitch Cu/low-k FCBGA packages by Ong, Xuefen, Ho, Soon Wee, Ong, Yue Ying, Wai, Leong Ching, Vaidyanathan, Kripesh, Lim, Yeow Kheng, Yeo, David, Chan, Kai Chong, Tan, Juan Boon, Sohn, Dong Kyun, Hsia, Liang Choo, Chen, Zhong

Get full text

A dual-domain 3ω method for measuring the in-plane thermal conductivity of high-conductive thin films by Liu, Paiting, Wen, Yue, Siah, Chun Fei, Pam, Mei Er, Xu, Baochang, Thean, Aaron Voon-Yew, Lim, Yeow Kheng, Shin, Sunmi

Get full text

Design, assembly and reliability of large die and fine-pitch Cu/low- k flip chip package by Ong, Yue Ying, Ho, Soon Wee, Vaidyanathan, Kripesh, Sekhar, Vasarla Nagendra, Jong, Ming Chinq, Yak Long, Samuel Lim, Wen Sheng, Vincent Lee, Wai, Leong Ching, Rao, Vempati Srinivasa, Ong, Jimmy, Ong, Xuefen, Zhang, Xiaowu, Seung, Yoon Uk, Lau, John H., Lim, Yeow Kheng, Yeo, David, Chan, Kai Chong, Yanfeng, Zhang, Tan, Juan Boon, Sohn, Dong Kyun

Get full text

Multi-axial Elastic Averaging for Sub-Micron Passive Alignment of Photonic Components by Goh, Simon Chun Kiat, Siah, Chun Fei, Xu, Baochang, Zhang, Yu, Pam, Mei Er, Guevarra, Enrico, Goh, Edwin Sze Ping, Wang, Lin, Pile, Brian, Carlan, Arbiz, Lee, James Yong Meng, Venkatesan, Suresh, Lim, Yeow Kheng, Thean, Aaron Voon-Yew

Get full text

Underfill Selection, Characterization, and Reliability Study for Fine-Pitch, Large Die Cu/Low-K Flip Chip Package by Yue Ying Ong, Soon Wee Ho, Sekhar, V N, Xuefen Ong, Ong, J, Xiaowu Zhang, Vaidyanathan, K, Seung Uk Yoon, Lau, J H, Lim Yeow Kheng, Yeo, D, Kai Chong Chan, Yanfeng Zhang, Juan Boon Tan, Dong Kyun Sohn

Get full text

Downstream electromigration improvement in 45nm technology by Yinghong Zhao, Xu Zeng, Wei Liu, Fan Zhang, Yeow Kheng Lim

Request full text

A Wafer Scale Hybrid Integration Platform for Co-packaged Photonics using a CMOS based Optical InterposerTM by Venkatesan, Suresh, Lee, James, Kiat Goh, Simon Chun, Pile, Brian, Meerovich, Daniel, Mo, Jinyu, Jing, Yang, Soldano, Lucas, Xu, Baochang, Zhang, Yu, Yew Thean, Aaron Voon, Kheng Lim, Yeow

Request full text

Investigation and Failure Analysis of "Flower-like" Defects on Microchip Aluminum Bondpads in Wafer Fabrication by Hua Younan, Lim Yeow Kheng, Zhao Siping, Ramesh, R., Tan Juan Boon

Request full text

Effect of via etching process and postclean treatment on via electrical performance by CHIEW NYUK HO, YEOW KHENG LIM, GERALD, Higelin, WANG LING GOH, MAN SIU TSE, SEE, Alex

Get full text

Effects of side reservoirs on the electromigration lifetime of copper interconnects by Mario, Hendro, Chee Lip Gan, Yeow Kheng Lim, Juan Boon Tan, Jun Wei, Chookajorn, Tongjai, Thompson, Carl V.

Request full text

BEOL Advance Interconnect Technology Overview and Challenges by Liang Choo Hsia, Tan, J.B., Bei Chao Zhang, Wu Ping Liu, Yeow Kheng Lim, Dong Kyun Sohn

Request full text

Study of Board Level Reliability of eWLB (embedded Wafer Level BGA) for 0.35mm Ball Pitch by Lee, Kang Hai, Lim, Yeow Kheng, Chow, Seng Guan, Chen, Kang, Choi, Won Kyung, Yoon, Seung Wook, Liu, N.W., Chi, Yenyao, Lin, Benson

Request full text

A novel integrated scheme to improve the electrical and electromigration performance of Cu interconnects by Yeow Kheng Lim, Suat Cheng Khoo, Kai Tern Sih, Chim Seng Seet, Bei Chao Zhang, Tae Jong Lee

Request full text

Isothermal em as highly accelerated test method for copper damascene lines by Kin Leong, Yap Andrew, Bee Hoon Lim, Eng Chye Chua, Yeow Kheng Lim, Suat Cheng, Khoo Sherry

Request full text

Structural Design and Optimization of 65nm Cu/low-k Flipchip Package by Ong, Jimmy, Tay, Andrew, Zhang, Xiaowu, Kripesh, V., Lim, Yeow Kheng, Yeo, David, Chan, Kai Chong, Tan, Juan Boon, Hsia, Liang Choo, Sohn, Dong Kyun

Request full text

A Systematic Underfill Selection Methodology for Fine Pitch Cu/Low-k FCBGA Package by Ong, Xuefen, Sohn, Dong Kyun, Hsia, Liang Choo, Chen, Zhong, Ho, Soon Wee, Ong, Yue Ying, Wai, Leong Ching, Vaidyanathan, Kripesh, Lim, Yeow Kheng, Yeo, David, Chan, Kai Chong, Tan, Juan Boon

Request full text

Design, Assembly and Reliability of Large Die (21 x 21mm2) and Fine-pitch (150pm) Cu/Low-K Flip Chip Package by Ong, Y.Y., Vaidyanathan, K., Ho, S.W., Sekhar, V.N., Jong, M.C., Wai, L.C., Rao, V.S., Sheng, V., Ong, J., Ong, X., Zhang, X., Seung, Y.U., Lau, J., Lim, Y.K., Yeo, D., Chan, K.C., Yanfeng, Z., Tan, J.B., Sohn, D.K.

Request full text

Genetic risk of extranodal natural killer T-cell lymphoma: a genome-wide association study in multiple populations by Lin, Guo-Wang, Xu, Caigang, Chen, Jieping, Chan, John K C, Li, Wenyu, Liu, Weiping, Shih, Lee-Yung, Kim, Won Seog, Tan, Wen, Peng, Rou-Jun, Cheah, Daryl Ming Zhe, Huang, DaChuan, Cheng, Chee Leong, Su, Yi-Jiun, Tan, Soo-Yong, Wang, Vivien Ya-Fan, Jia, Wei-Hua, Li, Ya-Jun, Gao, Song, Hu, Zhibin, Zhang, Furen, Zeng, Yi-Xin, Shen, Hongbing, He, Lin, Ong, Choon Kiat, Chanock, Stephen, Rothman, Nathaniel, Khor, Chiea Chuen, Bei, Jin-Xin, Chiu, Brian, Li, Zheng, LAM, Tai Hing, Xu, Jun, Ip, Dennis Kai Ming, Li, Gandi, Xu, Gang, Wang, Xiaodong, Bai, Ou, Cai, Qing-Qing, Xia, Yi, Chen, Jie-Rong, Luo, Chun-Ling, Zeng, Yanni, Wei, Pan-Pan, Liu, Chu-Jun, Liu, Yu-Xiang, Cao, Yu-Lu, He, Shuai, Liu, Yang, Ha, Jeslin Chian Hung, Khoo, Lay Poh, Kee, Rebecca Xiangpin, Liu, Yanhui, Zhang, Fen, Feng, Yanfen, Chng, Wee Joo, Chan, Jason Yong Sheng, Somasundaram, Nagavalli D/O, Ras, Mohamad Farid Bin Harunal, Yeoh, Kheng-Wei, Goh, Yeow Tee, Grigoropoulos, Nicholas Francis, Wong, Esther Kam Yin, Pang, Jane Wan Lu, Chia, Burton Kuan Hui, Kim, Seok Jin, Yoon, Sang Eun, Kuo, Ching-Yuan, Chen, Tsai-Yun, Huang, Wen-Tsung, Lee, Ming-Yang, Ngan, Kai-Cheong, Liu, Herman, Yip, Sze-Fai, Liu, Jie, Li, Jianyong, Berndt, Sonja, Bassig, Bryan, Hu, Wei, Li, Yuming, Zhai, Qiongli, Shao, Zonghong, Qiu, Lugui, Xu, Shuangnian, Huang, Zhen, Zhong, Shilong, Zhang, Yan, Wang, Xin, Foo, Jia Nee, Dai, Juncheng, Sun, Liangdan, Wang, Zhenzhen, Liu, Hong, Zhou, Hui, Heng, Chew-Kiat, Hong, Chew Soo, Ahn, Jeeyun, Tin, Aung, Li, Bo, Yu, Xueqing

Get full text

Haploidentical Transplant Using Selective Ex-vivo TCR-Αβ Depleted and Upfront Memory T-Cell Add-Back Is Associated with Lower Chronic Gvhd and More Favorable Gvhd-Free/Relapse-Free... by Wei Teik, Victor Ling, Linn, Yeh Ching, Han, Huirong, Poon, Michelle, Tan, Lip Kun, Lee, Joanne Shu Xian, Boo, Yang Liang, Wu, Ian, Catapia, Jean Rachel, Ho, Aloysius Yew Leng, Hwang, William Ying Khee, Goh, Yeow Tee, Lim, Francesca, Than, Hein, Ng, Lawrence Cheng Kiat, Quek, Jeffrey Kim Siang, Tuy, Tertius Tansloan, Vellayappan, Balamurugan, Lim, Zi Yi, Diong, Colin Phipps, Loh, Yvonne, Yeoh, Kheng Wei, Ho, Brian, Looi, Wen Shen, Koh, Yin Jie, Soh, Teck Guan, Heng, Kee Khiang, Gan, Gina, Leung, Wing, Koh, Liang Piu

Get full text

Tuberculosis associated with Mycobacterium tuberculosis Beijing and non-Beijing genotypes: a clinical and immunological comparison by Sun, Yong-Jiang, Lim, T K, Ong, Adrian Kheng Yeow, Ho, Benjamin Choon Heng, Seah, Geok Teng, Paton, Nicholas I

Get full text