Search Results - Ling, Diying

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  1. 1
    Effects of Joint Height on the Interfacial Microstructure and Mechanical Properties of Cu-Cored SAC305 Solder Joints

    Effects of Joint Height on the Interfacial Microstructure and Mechanical Properties of Cu-Cored SAC305 Solder Joints by Yao, Zongxiang, Jiang, Shan, Yin, Limeng, Ling, Diying, Zhang, Zhongwen, Zhang, Liping

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  2. 2
    Effect of Ni content on the creep properties of Cu/Sn–0.3Ag–0.7Cu/Cu solder micro-joints

    Effect of Ni content on the creep properties of Cu/Sn–0.3Ag–0.7Cu/Cu solder micro-joints by Yao, Zongxiang, Ling, Diying, Yin, Limeng, Wang, Gang, Zhang, Hehe, Jiang, Shan

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  3. 3
    Effect of multi-walled carbon nanotubes on the microstructure and properties of Sn-58Bi solder alloys

    Effect of multi-walled carbon nanotubes on the microstructure and properties of Sn-58Bi solder alloys by Yao, Zongxiang, Zhang, Yan, Ling, Diying, Yin, Limeng, Wang, Gang, Zhang, Hehe, Zhang, Liping, Zhang, Long

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  4. 4
    Effect of Cu Addition on the Microstructure and Mechanical Properties of Sn-58Bi-0.5Ag Solder Alloys

    Effect of Cu Addition on the Microstructure and Mechanical Properties of Sn-58Bi-0.5Ag Solder Alloys by Yao, Zongxiang, Ling, Diying, Liu, Yikai, Sun, Jiashuai, Yin, Limeng, Wang, Gang, Zhang, Long

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