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Monolithically GaN-based Optocoupler with Chip Scaling
by
Liou, Chengshiun
,
Tsou, Chingfu
Published in
IEEE transactions on components, packaging, and manufacturing technology (2011)
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Micro-Cantilever Array With Electroplating Tin Bumps for Flip-Chip Bonding Technology
by
Hu, Zihsong
,
Liou, Chengshiun
,
Tsou, Chingfu
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IEEE transactions on components, packaging, and manufacturing technology (2011)
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Compact Dual-LED Packaging With a 3-D Free-Form Lens for Uniform Rectangular Illumination
by
Liou, Chengshiun
,
Tsou, Chingfu
Published in
IEEE transactions on components, packaging, and manufacturing technology (2011)
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A study of the effect of different coplanar dual-coil geometries on the performance of mutual inductance
by
Liao, Siansyun
,
Li, Weichen
,
Lin, Shihwei
,
Tang, Kenwei
,
Liou, Chengshiun
,
Tsou, Chingfu
Published in
Sensors and actuators. A. Physical.
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The Implementation of Sapphire Microreflector for Monolithic Micro-LED Array
by
Liou, Chengshiun
,
Shih, Fuchi
,
Huang, Yuanyuan
,
Hu, Zihsong
,
Tsou, Chingfu
,
Fang, Weileun
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IEEE transactions on components, packaging, and manufacturing technology (2011)
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A silicon-based dual-LED packaging module with a three-dimension freeform lens for square illumination
by
Chengshiun Liou
,
Chingfu Tsou
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Silicon-based LED packaging module with a TiO2 capacitive temperature sensor
by
Shihwei Lin
,
Kenwei Tang
,
Mingyu Hsieh
,
Chengshiun Liou
,
Chingfu Tsou
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Design and Fabrication of Micro-LED Display with Sapphire Micro-Reflector Array
by
Liou, Chengshiun
,
Hsieh, Mingyu
,
Shih, Fuchi
,
Huang, Yuanyuan
,
Hu, Zihsong
,
Tsou, Chingfu
,
Fang, Weileun
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