Search Results - Litteken, C.S.

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    Comparison of the telephone cord delamination method for measuring interfacial adhesion with the four-point bending method

    Comparison of the telephone cord delamination method for measuring interfacial adhesion with the four-point bending method by Lee, Alan, Litteken, C.S., Dauskardt, R.H., Nix, W.D.

    Published in Acta materialia
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  2. 2
    Effects of friction and loading parameters on four-point bend adhesion measurements of low-k thin film interconnect structures

    Effects of friction and loading parameters on four-point bend adhesion measurements of low-k thin film interconnect structures by Gage, D.M., Kyunghoon Kim, Litteken, C.S., Dauskardt, R.H.

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