Mechanical Behaviour of Grains in SnAgCu Solder Joints by Jicheng Gong, Changging Liu, Conway, P.P., Silberschmidt, V.V.

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Mesomechanical modelling of SnAgCu solder joints in flip chip by Jicheng Gong, Changqing Liu, Paul Conway, Vadim Silberschmidt

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Crystallographic structure and mechanical behaviour of SnAgCu solder interconnects under a constant loading rate by Jicheng Gong, Changqing Liu, Paul Conway, Vadim Silberschmidt

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Chiral phosphine ligands derived from sugars-6. syntheses and spectroscopic studies on rhodium complexes with a new type of chiral phosphines by Shi, Jicheng, Wu, Daxu, Wen, Tingbin, Lu, Getan, Liu, Qiutian, Rang, Beisheng

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Grain features of SnAgCu solder and their effect on mechanical behaviour of micro-joints by Jicheng Gong, Changqing Liu, Paul Conway, Vadim Silberschmidt

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Mechanical behaviour of grains in SnAgCu solder joints by Jicheng Gong, Changqing Liu, Paul Conway, Vadim Silberschmidt

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APPLICATION AND EFFECTS OF RARE-EARTH ON SEEDLINGS

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An exploration on the nature of hole traps A and B in LPE n-type GaAs by Jicheng, Zhou, Liansheng, Li, Miaoxiu, Liu, Bingfang, Lu, Jue, Zhang

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A client/server based distributed parallel approach for achieving real-time complex scene rendering by Hongmei Sun, Jicheng ren, Shenquan Liu

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EFFECT OF FERTILIZATION ON THE GROWTH OF LARCH SEEDLINGS

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MD16: DSP with some RISC features for embedded system by Jicheng Chen, Qingdong Yao, Peng Liu, Ce Chi

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台灣股市券商分析師盈餘預測之利益衝突 by 賴紀誠(Chi-Cheng Lai), 林問一(Wen-Yi Lin), 劉亞秋(Angela Y. Liu)

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