Search Results - Liverød, B.

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    Measurement of package-induced stress and thermal zero shift in transfer molded silicon piezoresistive pressure sensors

    Measurement of package-induced stress and thermal zero shift in transfer molded silicon piezoresistive pressure sensors by ther, J B Nysæ, Larsen, A, Liverød, B, Ohlckers, P

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    Structures for piezoresistive measurement of package induced stress in transfer molded silicon pressure sensors

    Structures for piezoresistive measurement of package induced stress in transfer molded silicon pressure sensors by Nysæther, J.B., Larsen, A., Liverød, B., Ohlckers, P.

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