Thermally activated solvent bonding of polymers by Ng, S. H., Tjeung, R. T., Wang, Z. F., Lu, A. C. W., Rodriguez, I., de Rooij, N. F.

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Characterization of SnAgCu and SnPb solder joints on low-temperature co-fired ceramic substrate by Zhong, Z.W, Arulvanan, P, Phone Maw, Hla, Lu, C.W.A

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Planar waveguide devices based on sol–gel-derived photopatternable hybrid material by Zhang, X., Zhao, Z., Qian, M., Lee, S.Y., Chin, M.K., Zeng, X., Low, D.K.Y., Lu, A.C.W., Plante, P.

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Circuit model of microstrip patch antenna on ceramic land grid array package for antenna-chip codesign of highly integrated RF transceivers by Wang, J.J., Zhang, Y.P., Kai Meng Chua, Lu, A.C.W.

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Miniaturized Multilayer UWB Antennas on LTCC by Kah-Wee Khoo, Zhi Ning Chen, Lu, A.C.W., Sunappan, V., Lai Lai Wai

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Hybrid analytical modeling method for split power bus in multilayered package by Youchul Jeong, Lu, A.C.W., Wai, L.L., Wei Fan, Lok, B.K., Hyunjeong Park, Kim, Joungho

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Hydrothermal growth of BaTiO3 thin films on printed circuit boards for integral capacitor applications by TAN, C. K, GOH, Gregory K. L, CHI, D. Z, LU, Albert C. W, LOK, B. K

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Frequency-band selection for an integrated-circuit package antenna using LTCC technology by Wang, J. J., Xue, Y., Zhang, Y. P., Chua, K. M., Lu, A. C. W., Wai, Lai L., Wong, C. K.

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Roll-to-roll (R2R) hot embossing for structuring 3D microstructures on polymer films by Shan, X. C., Mohahidin, M. B., Lu, A. C. W.

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A flexible modified dipole antenna printed on PET film by Lei Wang, Yong-Xin Guo, Salam, B., Lu, C. W. A.

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Formation of large format functional films via roll-to-roll (R2R) ultraviolet (UV) embossing by Shan, X. C., Lau, S. K., Mohahidin, M. B., Liu, T., Lu, A. C. W.

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Full-wave modeling and analysis of screen printed EMI shield by Wang, L B, See, K Y, Zhang, J W, Lu, A C W, Ng, S T

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Processing and characterization of flexographic printed conductive grid by Lok Boon Keng, Wai Lai Lai, Lu, C. W. A., Salam, B.

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Parametric Analysis of Embedded EBG Structures for Noise Suppression Applications by Ng, Y.T., Wai, L.L., Fan, W., Gian, P.W., Lu, H., Lu, A.C.W.

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Formation of Embedded Microstructures by Thermal Activated Solvent Bonding by Ng, S H, Tjeung, R T, Wang, Z F, Lu, A C W, Rodriguez, I, De Rooij, N

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Dual heterogeneous structures lead to ultrahigh strength and uniform ductility in a Co-Cr-Ni medium-entropy alloy by Du, X. H., Li, W. P., Chang, H. T., Yang, T., Duan, G. S., Wu, B. L., Huang, J. C., Chen, F. R., Liu, C. T., Chuang, W. S., Lu, Y., Sui, M. L., Huang, E. W.

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Neuropsychiatric symptoms in Alzheimer's disease: associations with caregiver burden and treatment outcomes by Chen, C T, Chang, C-C, Chang, W-N, Tsai, N-W, Huang, C-C, Chang, Y-T, Wang, H-C, Kung, C-T, Su, Y-J, Lin, W-C, Cheng, B-C, Su, C-M, Hsiao, S-Y, Hsu, C-W, Lu, C-H

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Trends in the susceptibility of methicillin-resistant Staphylococcus aureus to nine antimicrobial agents, including ceftobiprole, nemonoxacin, and tyrothricin: results from the Tig... by Chen, Y.-H., Liu, C.-Y., Ko, W.-C., Liao, C.-H., Lu, P.-L., Huang, C.-H., Lu, C.-T., Chuang, Y.-C., Tsao, S.-M., Chen, Y.-S., Liu, Y.-C., Chen, W.-Y., Jang, T.-N., Lin, H.-C., Chen, C.-M., Shi, Z.-Y., Pan, S.-C., Yang, J.-L., Kung, H.-C., Liu, C.-E., Cheng, Y.-J., Liu, J.-W., Sun, W., Wang, L.-S., Yu, K.-W., Chiang, P.-C., Lee, M.-H., Lee, C.-M., Hsu, G.-J., Hsueh, P.-R.

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Chronic Hepatitis C Virus Infection Increases Mortality From Hepatic and Extrahepatic Diseases: A Community-Based Long-Term Prospective Study by Lee, Mei-Hsuan, Yang, Hwai-I., Lu, Sheng-Nan, Jen, Chin-Lan, You, San-Lin, Wang, Li-Yu, Wang, Chih-Hao, Chen, Wei J., Chen, Chien-Jen

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Prediction of RNA-Binding Proteins by Voting Systems by Peng, C. R., Liu, L., Niu, B., Lv, Y. L., Li, M. J., Yuan, Y. L., Zhu, Y. B., Lu, W. C., Cai, Yu-Dong

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