Search Results - Luehn, Ole

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  1. 1
    Leveling of Microvias by Electroplating for Wafer Level Packaging

    Leveling of Microvias by Electroplating for Wafer Level Packaging by Luehn, Ole, Celis, Jean-Pierre, Van Hoof, Chris, Baert, Kris, Ruythooren, Wouter

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  2. 2
    (Invited) Through-Silicon Via Technology for 3D Applications

    (Invited) Through-Silicon Via Technology for 3D Applications by Philipsen, Harold G., Lühn, Ole, Civale, Yann, Wang, Yu-Shuen, Sabuncuoglu Tezcan, Deniz, Ruythooren, Wouter

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  3. 3
    Copper Plating for 3D Interconnects

    Copper Plating for 3D Interconnects by Radisic, Aleksandar, Lühn, Ole, Vaes, Jan, Armini, Silvia, El-Mekki, Zaid, Radisic, Dunja, Ruythooren, Wouter, Vereecken, Philippe M.

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