Search Results - MASTER, Raj N

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  1. 1
    Void Formation Study of Flip Chip in Package Using No-Flow Underfill

    Void Formation Study of Flip Chip in Package Using No-Flow Underfill by Lee, S., Yim, M.J., Master, R.N., Wong, C.P., Baldwin, D.F.

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  2. 2
    Keynote address 1: "Connecting the dots to achieve high reliability and quality"

    Keynote address 1: "Connecting the dots to achieve high reliability and quality" by Master, Raj N.

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  3. 3
    Near Void-Free Assembly Development of Flip Chip Using No-Flow Underfill

    Near Void-Free Assembly Development of Flip Chip Using No-Flow Underfill by Sangil Lee, Myung Jin Yim, Master, R.N., Wong, C.P., Baldwin, D.F.

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  4. 4
    Impact of usage conditions on solder joint fatigue life

    Impact of usage conditions on solder joint fatigue life by Zhen Zhang, Park, S B, Darbha, Krishna, Master, Raj N

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  5. 5
    Effect of glass transition slope of underfill on solder joint fatigue life

    Effect of glass transition slope of underfill on solder joint fatigue life by Zhen Zhang, Park, S B, Darbha, Krishna, Master, Raj N

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  6. 6
    Orientation determination of flip-chip Pb-free solder for TEM application

    Orientation determination of flip-chip Pb-free solder for TEM application by Bernice, Zee, Xiaole Zhao, Pin Pin, Joman, Chin, J M, Master, Raj N

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  7. 7
    Root cause study on lid adhesion failure

    Root cause study on lid adhesion failure by Ong, M C, Zhao, X L, Zee, B, Joman, P P, Chin, J M, Master, Raj N

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  8. 8
    Design and process optimization for reliable resistor pack solder joints for microprocessor packages

    Design and process optimization for reliable resistor pack solder joints for microprocessor packages by SIDHARTH, GANNAMANI, Ranjit, ZHAI, Charlie J, BLISH, Richard C, MASTER, Raj N

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  9. 9
    Ceramic column grid array for flip chip applications

    Ceramic column grid array for flip chip applications by Master, R.N., Cole, M.S., Martin, G.B., Caron, A.

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  10. 10
    A low cost MCM-D process for flip chip and wirebonding applications

    A low cost MCM-D process for flip chip and wirebonding applications by Perfecto, E.D., Shields, R.R., Master, R.N.

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  11. 11
    Device interconnection technology for advanced thermal conduction modules

    Device interconnection technology for advanced thermal conduction modules by Ray, S.K., Beckham, K.F., Master, R.N.

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  12. 12
    3D fracture mechanics analysis of underfill delamination for flip chip packages

    3D fracture mechanics analysis of underfill delamination for flip chip packages by Zhen Zhang, Zhai, C.J., Master, R.N.

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  13. 13
    Investigation of Cu/low-k film delamination in flip chip packages

    Investigation of Cu/low-k film delamination in flip chip packages by Zhai, C.J., Ozkan, U., Dubey, A., Sidharth, Blish, R.C., Master, R.N.

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  14. 14
    Reliability Modeling of Lidded Flip Chip Packages

    Reliability Modeling of Lidded Flip Chip Packages by Zhai, C.J., Too, S.S., Master, R.N.

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  15. 15
    Lid adhesive failure study for flip chip packaging

    Lid adhesive failure study for flip chip packaging by Ong, M.C., Zhao, X.L., Joman, P.P., Chin, J.M., Master, R.N.

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  16. 16
    Electromigration of C4 bumps in ceramic and organic flip-chip packages

    Electromigration of C4 bumps in ceramic and organic flip-chip packages by Master, R.N., Amit Marathe, Pham, V., Morken, D.

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  17. 17
    Ceramic ball grid array for AMD K6 microprocessor application

    Ceramic ball grid array for AMD K6 microprocessor application by Master, R.N., Dolbear, T.P., Cole, M.S., Martin, G.B.

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  18. 18
    Novel jet fluxing application for advanced flip chip and BGA/CGA packages

    Novel jet fluxing application for advanced flip chip and BGA/CGA packages by Master, R.N., Dubey, A., Guardado, M., Ong, O.T., Donges, B., Okada, F.

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  19. 19
    Flip chip for AMD K6 microprocessor

    Flip chip for AMD K6 microprocessor by Master, R.N., Khan, M., Guardado, M., Starr, O., Alcid, E., Khor, L.

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  20. 20
    Solder column interposer for single chip ceramic packaging

    Solder column interposer for single chip ceramic packaging by Master, R.N., Dolbear, T., Ong, O.T., Dubey, A., Yamasaki, K., Saiki, H.

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