Search Results - Macurova, K.

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  1. 1
    Stress and Deflection Development During Die Embedding into Printed Circuit Boards

    Stress and Deflection Development During Die Embedding into Printed Circuit Boards by Macurova, K., Angerer, P., Bermejo, R., Pletz, M., Schöngrundner, R., Antretter, T., Krivec, T., Morianz, M., Brizoux, M., Lecavelier, A.

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    Multi-physics simulation of the component attachment within embedding process

    Multi-physics simulation of the component attachment within embedding process by Macurova, K., Kharicha, A., Pletz, M., Mataln, M., Bermejo, R., Schongrundner, R., Krivec, T., Antretter, T., Maia, W., Morianz, M., Brizoux, M.

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