Warpage Measurements and Characterizations of Fan-Out Wafer-Level Packaging With Large Chips and Multiple Redistributed Layers by Lau, John H., Li, Ming, Yang, Lei, Li, Margie, Xu, Iris, Chen, Tony, Chen, Sandy, Yong, Qing Xiang, Madhukumar, Janardhanan Pillai, Kai, Wu, Fan, Nelson, Kuah, Eric, Li, Zhang, Tan, Kim Hwee, Bao, Winsons, Lim, Sze Pei, Beica, Rozalia, Ko, Cheng-Ta, Xi, Cao

Get full text