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A new paradigm of using TEM in yield enhancement failure analysis for sub-micron integrated circuit devices
by
Oh, C.K.
,
Song, Z.G.
,
Neo, S.P.
,
Ang, G.B.
,
Magdeliza, G.
,
Redkar, S.
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Conference Proceedings
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Ausbeuteverlust
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Detectors
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Engineering
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Engineering, Electrical & Electronic
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Fabrication
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Failure Analysis
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Inspection
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Integrated Circuit Yield
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Ion Beams
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Physical Sciences
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Physics, Condensed Matter
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Scanning Electron Microscopy
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Science & Technology
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Technology
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Transmission Electron Microscopy
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Voltage
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Ieee Electronic Library (Iel) Conference Proceedings
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