Search Results - Mahalingam, Saketh

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    Modeling spatial strain gradient effects in thermo-mechanical fatigue of copper microstructures

    Modeling spatial strain gradient effects in thermo-mechanical fatigue of copper microstructures by Pucha, Raghuram V, Ramakrishna, Gnyaneshwar, Mahalingam, Saketh, Sitaraman, Suresh K

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  2. 2
    Design of underfill materials for lead free flip chip applications

    Design of underfill materials for lead free flip chip applications by Mahalingam, S., Goray, K., Joshi, A.

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    Materials, processes and reliability of mixed-signal substrates for SOP technology

    Materials, processes and reliability of mixed-signal substrates for SOP technology by MAHALINGAM, Saketh, HEGDE, Shashikant, AHMAD, Jamie, PUCHA, Raghuram V, SUNDARAM, Venky, FUHAN LIU, WHITE, George, TUMMALA, Rao, SITARAMAN, Suresh K

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