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A Sub-cm 3 Energy-Harvesting Stacked Wireless Sensor Node Featuring a Near-Threshold Voltage IA-32 Microcontroller in 14-nm Tri-Gate CMOS for Always-ON Always-Sensing Applications
by
Paul, Somnath
,
Honkote, Vinayak
,
Kim, Ryan Gary
,
Majumder, Turbo
,
Aseron, Paolo A.
,
Grossnickle, Vaughn
,
Sankman, Robert
,
Mallik, Debendra
,
Wang, Tao
,
Vangal, Sriram
,
Tschanz, James W.
,
De, Vivek
Published in
IEEE journal of solid-state circuits
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A Sub-cm3 Energy-Harvesting Stacked Wireless Sensor Node Featuring a Near-Threshold Voltage IA-32 Microcontroller in 14-nm Tri-Gate CMOS for Always-ON Always-Sensing Applications
by
Paul, Somnath
,
Honkote, Vinayak
,
Kim, Ryan Gary
,
Majumder, Turbo
,
Aseron, Paolo A.
,
Grossnickle, Vaughn
,
Sankman, Robert
,
Mallik, Debendra
,
Tao Wang
,
Vangal, Sriram
,
Tschanz, James W.
,
De, Vivek
Published in
IEEE journal of solid-state circuits
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Critical Aspects of High-Performance Microprocessor Packaging
by
Atluri, Vasudeva P.
,
Mahajan, Ravi V.
,
Patel, Priyavadan R.
,
Mallik, Debendra
,
Tang, John
,
Wakharkar, Vijay S.
,
Chrysler, Gregory M.
,
Chiu, Chia-Pin
,
Choksi, Gaurang N.
,
Viswanath, Ram S.
Published in
MRS bulletin
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Advanced Package Technologies for High-Performance Systems
by
Mallik, Debendra
Published in
Intel technology journal
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Thermal characteristics of single and multilayer high performance PQFP packages
by
Aghazadeh, M.
,
Mallik, D.
Published in
IEEE transactions on components, hybrids, and manufacturing technology
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Packaging alternatives for high lead count, fine pitch, surface mount technology
by
Chroneos, R.J.
,
Mallik, D.
,
Prough, S.D.
Published in
IEEE transactions on components, hybrids, and manufacturing technology
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