Environmental evaluation of new technology: printed electronics case study by Kunnari, Esa, Valkama, Jani, Keskinen, Marika, Mansikkamäki, Pauliina

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An inkjet-deposited antenna for 2.4 GHz applications by Mäntysalo, Matti, Mansikkamäki, Pauliina

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Inkjetting dielectric layer for electronic applications by Kaija, Kimmo, Pekkanen, Ville, Mäntysalo, Matti, Koskinen, Santtu, Niittynen, Juha, Halonen, Eerik, Mansikkamäki, Pauliina

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Functional fluid jetting performance optimization by Pekkanen, Ville, Kaija, Kimmo, Mäntysalo, Matti, Kunnari, Esa, Niittynen, Juha, Mansikkamäki, Pauliina

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Controlling warpage of molded package for inkjet manufacturing by Kaija, Kimmo, Pekkanen, Ville, Mäntysalo, Matti, Mansikkamäki, Pauliina

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Utilizing inkjet printing to fabricate electrical interconnections in a system-in-package by Pekkanen, Ville, Mäntysalo, Matti, Kaija, Kimmo, Mansikkamäki, Pauliina, Kunnari, Esa, Laine, Katja, Niittynen, Juha, Koskinen, Santtu, Halonen, Eerik, Caglar, Umur

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Formable multilayer PCB structure: design and technology demonstrator by Peltola, Tero, Mansikkamäki, Pauliina

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Molded Substrates for Inkjet Printed Modules by Miettinen, J., Kaija, K., Mantysalo, M., Mansikkamaki, P., Kuchiki, M., Tsubouchi, M., Ronkka, R., Hashizume, K., Kamigori, A.

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Analysis of mechanical performance of silver inkjet-printed structures by Caglar, U., Kimmo Kaija, Mansikkamaki, P.

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Evaluation of Inkjet Technology for Electronic Packaging and System Integration by Mantysalo, Matti, Mansikkamaki, Pauliina, Miettinen, Jani, Kaija, Kimmo, Pienimaa, Seppo, Ronkka, Risto, Hashizume, Kenichi, Kamigori, Akiko, Matsuba, Yorishige, Oyama, Kenshu, Terada, Nobuto, Saito, Hiroshi, Kuchiki, Mikiharu, Tsubouchi, Mikihiko

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Inkjet printed System-in-Package design and manufacturing by Miettinen, Jani, Pekkanen, Ville, Kaija, Kimmo, Mansikkamäki, Pauliina, Mäntysalo, Juha, Mäntysalo, Matti, Niittynen, Juha, Pekkanen, Jussi, Saviauk, Taavi, Rönkkä, Risto

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Capability of inkjet technology in electronics manufacturing by Mantysalo, M., Pekkanen, V., Kaija, K., Niittynen, J., Koskinen, S., Halonen, E., Mansikkamaki, P., Hameenoja, O.

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Application of wide-band material parameter extraction techniques to printable electronics characterization by Sillanpaa, H., Lilja, J., Makinen, R., Ostman, K., Palukuru, V., Virtanen, J., Pynttari, V., Kanerva, T., Hagberg, J., Lepisto, T., Jantunen, H., Mansikkamaki, P.

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Wide-band characterization of printable electronics materials: the effect of conductor loss and internal inductance on relative permittivity by Lilja, J., Sillanpaa, H., Makinen, R., Palukuru, V., Ostman, K., Hagberg, J., Kanerva, T., Jantunen, H., Lepisto, T., Mansikkamaki, P.

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Application of Thin-Film RCLG Model for the Modeling of Inkjet Printed Microstrip Lines by Lilja, J., Makinen, R., Pynttari, V., Mansikkamaki, P., Kivikoski, M.

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3D integration of electronics and mechanics by Peltola, T., Mansikkamaki, P., Ristolainen, E.O.

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Significance of Conductivity and Thickness of Thin Inkjet Printed Microstrip Lines by Pynttari, V., Makinen, R., Lilja, J., Pekkanen, V., Mansikkamaki, P., Kivikoski, M.

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Effects of 3D shapes in PWB design by Peltola, T., Mansikkamaki, P., Ristolainen, E.O.

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High-frequency characterization and simulation of conductor loss in printable electronics technology by Pynttari, V., Makinen, R., Lilja, J., Pekkanen, V., Mantysalo, M., Mansikkamaki, P., Kivikoski, M.

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