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Flexible, Highly Graphitized Carbon Aerogels Based on Bacterial Cellulose/Lignin: Catalyst-Free Synthesis and its Application in Energy Storage Devices
by
Xu, Xuezhu
,
Zhou, Jian
,
Nagaraju, D. H.
,
Jiang, Long
,
Marinov, Val R.
,
Lubineau, Gilles
,
Alshareef, Husam N.
,
Oh, Myungkeun
Published in
Advanced functional materials
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52‐4: Laser‐Enabled Extremely‐High Rate Technology for µLED Assembly
by
Marinov, Val R.
Published in
SID International Symposium Digest of technical papers
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Laser-assisted ultrathin die packaging: Insights from a process study
by
Marinov, Val R.
,
Swenson, Orven
,
Atanasov, Yuriy
,
Schneck, Nathan
Published in
Microelectronic engineering
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Volumetric Display Based on Two-Photon Absorption in Quantum Dot Dispersions
by
Lima, Ivan T
,
Marinov, Val R
Published in
Journal of display technology
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Optically transparent and structurally sound silica aerogels: insights from a process study
by
Athmuri, Kalyan
,
Marinov, Val
Published in
Advances in materials science
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A Review of Methods for the Reliability Testing of Flexible Hybrid Electronics
by
Davila-Frias, Alex
,
Yadav, Om Prakash
,
Marinov, Val
Published in
IEEE transactions on components, packaging, and manufacturing technology (2011)
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Toward cadmium-free spectral down-shifting converters for photovoltaic applications
by
Lesyuk, Rostyslav
,
Marinov, Val
,
Hobbie, Erik K.
,
Elbaradei, Ahmed
,
Tarnavchyk, Ihor
,
Bobitski, Yaroslav
Published in
Solar energy materials and solar cells
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A low‐cost compact antenna design on a paper substrate for near‐field passive UHF RFID tags
by
Sajal, Sayeed
,
Braaten, Benjamin D.
,
Marinov, Val
,
Swenson, Orv
,
Atanasov, Yuriy
Published in
Microwave and optical technology letters
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Laser-Enabled Advanced Packaging of Ultrathin Bare Dice in Flexible Substrates
by
Marinov, V.
,
Swenson, O.
,
Miller, R.
,
Sarwar, F.
,
Atanasov, Y.
,
Semler, M.
,
Datta, S.
Published in
IEEE transactions on components, packaging, and manufacturing technology (2011)
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Noncontact Selective Laser-Assisted Placement of Thinned Semiconductor Dice
by
Miller, R.
,
Marinov, V.
,
Swenson, O.
,
Zhigang Chen
,
Semler, M.
Published in
IEEE transactions on components, packaging, and manufacturing technology (2011)
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Simple, inexpensive, and reliable, high density interconnect technology for flexible electronics applications
by
Bhattacharya, S.
,
Marinov, V.
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Conference Proceeding
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