Self-management program for chronic low back pain: A systematic review and meta-analysis by Du, Shizheng, RN, Master in Nursing, Hu, Lingli, Bachelor in Clinical Medicine, Dong, Jianshu, Master in Psychology, Xu, Guihua, RN, Ph.D, Chen, Xuan, RN, Ph.D, Jin, Shengji, RN, Ph.D, Zhang, Heng, RN, Ph.D, Yin, Haiyan, RN, Master in Nursing

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Nitrofurantoin retains antimicrobial activity against multidrug-resistant urinary Escherichia coli from US outpatients by Sanchez, G V, Baird, A M G, Karlowsky, J A, Master, R N, Bordon, J M

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Escherichia coli antimicrobial resistance increased faster among geriatric outpatients compared with adult outpatients in the USA, 2000-10 by Sanchez, Guillermo V, Adams, Spencer J E, Baird, Alexis M G, Master, Ronald N, Clark, Richard B, Bordon, Jose M

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Authentic Leadership and Its Role in Registered Nurses’ Mental Health and Experiences of Workplace Bullying by Al-Hassan, Nadira Salman, Rayan, Ahmad Hussien, Baqeas, Manal Hassan, Hamaideh, Shaher H., Khrais, Huthaifah

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Trimethoprim-Sulfamethoxazole May No Longer Be Acceptable for the Treatment of Acute Uncomplicated Cystitis in the United States by Sanchez, Guillermo V., Master, Ronald N., Bordon, Jose

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High-performance glass-ceramic/copper multilayer substrate with thin-film redistribution by Tummala, R. R., Knickerbocker, J. U., Knickerbocker, S. H., Herron, L. W., Nufer, R. W., Master, R. N., Neisser, M. O., Kellner, B. M., Perry, C. H., Humenik, J. N., Redmond, T. F.

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Quantification of mast cells in the uterine cervix of women infected with human immunodeficiency virus by Guimarães, Janaína Valadares, RN, PhD, Costa, Fabiana Bettanin, Andrade, Wanessa Machado, Vêncio, Eneida Franco, RN, PhD, Salge, Ana Karina Marques, RN, PhD, Siqueira, Karina Machado, RN, Master in Nursing, Texeira, Vicente de Paula Antunes, MD, PhD

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Void Formation Study of Flip Chip in Package Using No-Flow Underfill by Lee, S., Yim, M.J., Master, R.N., Wong, C.P., Baldwin, D.F.

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Near Void-Free Assembly Development of Flip Chip Using No-Flow Underfill by Sangil Lee, Myung Jin Yim, Master, R.N., Wong, C.P., Baldwin, D.F.

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Ceramic ball grid array for AMD K6 microprocessor application by Master, R.N., Dolbear, T.P., Cole, M.S., Martin, G.B.

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Recent Paramedic Graduates’ Chronic Stress Adds Intentions to Leave the Profession: A Pilot Study Utilizing a Web-Based Survey by Herttuainen, Anniina, Nordquist, Hilla

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Kinetics of C4 bump degradation in overly aggressive HTOL by Master, R.N., Blish, R.C., Morken, D., Adem, E.

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Non-destructive analysis on flip chip package with TDR (time domain reflectometry) and SQUID (superconducting quantum interference device) by Lihong Cao, Chong, H.B., Chin, J.M., Master, R.N.

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Flip chip for AMD K6 microprocessor by Master, R.N., Khan, M., Guardado, M., Starr, O., Alcid, E., Khor, L.

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Cofiring process for glass-Ceramic/copper multilayer ceramic substrate by Master, R.N., Herron, L.W., Tummala, R.R.

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Device interconnection technology for advanced thermal conduction modules by Ray, S.K., Beckham, K.F., Master, R.N.

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Investigation and minimization of underfill delamination in flip chip packages by Zhai, C.J., Sidharth, Blish, R.C., Master, R.N.

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High-performance glass-ceramic/copper multilayer substrate with thin-film redistribution: ES/9000 semiconductor and packaging technologies by TUMMALA, R. R, KNICKERBOCKER, J. U, REDMOND, T. F, KNICKERBOCKER, S. H, HERRON, L. W, NUFER, R. W, MASTER, R. N, NEISSER, M. O, KELLNER, B. M, PERRY, C. H, HUMENIK, J. N

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Ring voids and solder extrusion mechanism for flip chip packaging by Zhao, X.L., Chin, J.M., Master, R.N.

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Design and process optimization for reliable resistor pack solder joints for microprocessor packages by SIDHARTH, GANNAMANI, Ranjit, ZHAI, Charlie J, BLISH, Richard C, MASTER, Raj N

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