Search Results - Matejat, K

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    Electrolytic solder deposit for next generation flip chip solder bumping

    Electrolytic solder deposit for next generation flip chip solder bumping by Roelfs, B, Kenny, S, Matejat, K

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    Electrolytic solder deposit for next generation flip chip solder bumping: 2010 International Microsystems, Packaging, Assembly and Circuits Technology (IMPACT) conference

    Electrolytic solder deposit for next generation flip chip solder bumping: 2010 International Microsystems, Packaging, Assembly and Circuits Technology (IMPACT) conference by Kenny, S, Roelfs, B, Matejat, K, Magaya, T, Massey, R

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