Search Results - Mayhuan Lim

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  1. 1
    Consideration of Mold Compound Cure Shrinkage in Finite Element Modeling

    Consideration of Mold Compound Cure Shrinkage in Finite Element Modeling by Chua Li Yean, Mayhuan Lim, Yeo, A., Lee, C.

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  2. 2
    Impact of Mold Compound Cure Shrinkage on Substrate Block Warpage Simulation

    Impact of Mold Compound Cure Shrinkage on Substrate Block Warpage Simulation by Mayhuan Lim, Chua Li Yean, Yeo, A., Lee, C.

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  3. 3
    Design analysis of solder joint reliability for stacked die mixed flip-chip and wirebond BGA

    Design analysis of solder joint reliability for stacked die mixed flip-chip and wirebond BGA by Tee Tong Yan, Mayhuan Lim, Ng Hun Shen, Baraton, X., Kaire, D., Zhong Zhaowei

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  4. 4
    DESIGN FOR BOARD LEVEL RELIABILITY OF A MINIATURIZED MEMS PACKAGE: STACKED DIE TQFN

    DESIGN FOR BOARD LEVEL RELIABILITY OF A MINIATURIZED MEMS PACKAGE: STACKED DIE TQFN by TEE, TONG Y., FREZZA, GIOVANNI, LIM, MAYHUAN, NG, HUN S., ZIGLIOLI, FEDERICO, ZHONG, ZHAOWEI

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