Search Results - McCluskey, F.P.

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  1. 1
    Reliability of high temperature solder alternatives

    Reliability of high temperature solder alternatives by McCluskey, F.P., Dash, M., Wang, Z., Huff, D.

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  2. 2
    Eliminating infant mortality in metallized film capacitors by defect detection

    Eliminating infant mortality in metallized film capacitors by defect detection by McCluskey, F.P., Li, N.M., Mengotti, E.

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  3. 3
    Physics-of-failure assessment methodology for power electronic systems

    Physics-of-failure assessment methodology for power electronic systems by Squiller, D., Greve, H., Mengotti, E., McCluskey, F.P.

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  4. 4
    Packaging Reliability for High Temperature Electronics: A Materials Focus

    Packaging Reliability for High Temperature Electronics: A Materials Focus by McCluskey, F.P, Condra, L, Torri, T, Fink, J

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  5. 5
    A multidisciplinary sophomore course in electronics packaging

    A multidisciplinary sophomore course in electronics packaging by Morris, J.E., McCluskey, F.P.

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  6. 6
    Method for assessing remaining life in electronic assemblies

    Method for assessing remaining life in electronic assemblies by McCluskey, F.P, Kweon, Y.D, Lee, H.J, Kim, J.W, Jeon, H.S

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  7. 7
    Modeling transient thermal response of pulsed power electronic packages

    Modeling transient thermal response of pulsed power electronic packages by Jankowski, N.R., McCluskey, F.P.

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  8. 8
    Constitutive relations of indium solder joint in cold temperature electronic packaging based on Anand model

    Constitutive relations of indium solder joint in cold temperature electronic packaging based on Anand model by Rui Wu, McCluskey, F.P.

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  9. 9
    Reliability of High Temperature Lead-Free Solder Alternative

    Reliability of High Temperature Lead-Free Solder Alternative by McCluskey, F.P., Wang, Z., Dash, M., Huff, D.

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  10. 10
    Uprating electronic components for use outside their temperature specification limits

    Uprating electronic components for use outside their temperature specification limits by Wright, M.B., Humphrey, D., McCluskey, F.P.

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  11. 11
    A multi-university web-based undergraduate course in electronics packaging

    A multi-university web-based undergraduate course in electronics packaging by Morris, J.E., McCluskey, F.P.

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  12. 12
    Die attach and wirebond systems for high temperature electronics

    Die attach and wirebond systems for high temperature electronics by McCluskey, F.P., Jain, R., Tiwari, N., Grzybowski, R., Benoit, J., Lin, S.

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  13. 13
    Reliability assessment of electronic components exposed to long-term non-operating conditions

    Reliability assessment of electronic components exposed to long-term non-operating conditions by McCluskey, F.P., Hakim, E.B., Fink, J., Fowler, A., Pecht, M.G.

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  14. 14
    Packaging of an Iron-Gallium Nanowire Acoustic Sensor

    Packaging of an Iron-Gallium Nanowire Acoustic Sensor by Disabatino, R.J., McCluskev, F.P., Flatau, A.B., James Clark, A.

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