Search Results - McGouey, R.

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  1. 1
    High-speed signal propagation on lossy transmission lines

    High-speed signal propagation on lossy transmission lines by DEUTSCH, A, KOPCSAY, G. V, SERINO, R. J, SHIH, D. Y, WILCZYNSKI, J. S, RANIERI, V. A, CATALDO, J. K, GALLIGAN, E. A, GRAHAM, W. S, MCGOUEY, R. P, NUNES, S. L, PARASZCZAK, J. R, RITSKO, J. J

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  2. 2
    Comparison of vapor and liquid phase silylation processes of photoresists

    Comparison of vapor and liquid phase silylation processes of photoresists by Babich, E., Paraszczak, J., Gelorme, J., McGouey, R., Brady, M., Nunes, R., Smith, R.

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  3. 3
    Silylation of resist materials using di- and polyfunctional organosilicon compounds

    Silylation of resist materials using di- and polyfunctional organosilicon compounds by Babich, E., Paraszczak, J., Witman, D., McGouey, R., Hatzakis, M., Shaw, J., Chou, N.

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  4. 4
    Fabrication of contiguous-disk magnetic bubble devices

    Fabrication of contiguous-disk magnetic bubble devices by Kie Ahn, Cox, D., Gangulee, A., Kane, S., Kobliska, R., McGouey, R., Tuxford, A.

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  5. 5
    Factors affecting the interconnection resistance and yield in the fabrication of multilayer polyimide/metal thin film structures

    Factors affecting the interconnection resistance and yield in the fabrication of multilayer polyimide/metal thin film structures by Shih, D.-Y., Yeh, H., Narayan, C., Lewis, J., Graham, W., Nunes, S., Paraszczak, J., McGouey, R., Galligan, E., Cataldo, J., Serino, R., Perfecto, E., Chang, C.-A., Deutsch, A., Rothman, L., Ritsko, J., Wilczynski, J.

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  6. 6
    Factors affecting the interconnection resistance and yield in multilayer polyimide/copper structures

    Factors affecting the interconnection resistance and yield in multilayer polyimide/copper structures by Shih, D.-Y., Yeh, H.L., Paraszczak, J., Lewis, J., Graham, W., Nunes, S., Narayan, C., McGouey, R., Galligan, E., Cataldo, J., Serino, R., Perfecto, E., Chang, C.-A., Deutsch, A., Rothman, L., Ritsko, J.J., Wilczynski, J.S.

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  7. 7
    Fabrication and performance studies of multilayer polymer/metal interconnect structures for packaging applications

    Fabrication and performance studies of multilayer polymer/metal interconnect structures for packaging applications by Paraszczak, J., Cataldo, J., Galligan, E., Graham, W., McGouey, R., Nunes, S., Serino, R., Shih, D.Y., Babich, E., Deutsch, A., Kopcsay, G., Goldblatt, R., Hofer, D., Labadie, J., Hedrick, J., Narayan, C., Saenger, K., Shaw, J., Ranieri, V., Ritsko, J., Rothman, L., Volksen, W., Wilczynski, J., Witman, D., Yeh, H.

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  8. 8
    The use of organosilicon polymers in multilayer plasma resist processing

    The use of organosilicon polymers in multilayer plasma resist processing by Paraszczak, J., Babich, E., McGouey, R., Heidenreich, J., Hatzakis, M., Shaw, J.

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  9. 9
    Silylation of resist materiams using di-polyfunctional organosilicon compounds

    Silylation of resist materiams using di-polyfunctional organosilicon compounds by BABICH, E, PARASZCZAK, J, WITMAN, D, MCGOUEY, R, HATZAKIS, M, SHAW, J, CHOU, N

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