Aggressively Scaled Strained-Silicon-on-Insulator Undoped-Body High- \kappa/Metal-Gate nFinFETs for High-Performance Logic Applications by Maitra, K, Khakifirooz, A, Kulkarni, P, Basker, V S, Faltermeier, J, Jagannathan, H, Adhikari, H, Chun-Chen Yeh, Klymko, N R, Saenger, K, Standaert, T, Miller, R J, Doris, B, Paruchuri, V K, McHerron, D, O'Neil, J, Leobundung, E, Huiming Bu

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Prototype of multi-stacked memory wafers using low-temperature oxide bonding and ultra-fine-dimension copper through-silicon via interconnects by Wei Lin, Faltermeier, Johnathan, Winstel, Kevin, Skordas, Spyridon, Graves-Abe, Troy, Batra, Pooja, Herman, Kenneth, Golz, John, Kirihata, Toshiaki, Garant, John, Hubbard, Alex, Cauffman, Kris, Levine, Theodore, Kelly, James, Priyadarshini, Deepika, Peethala, Brown, Patlolla, Raghuveer, Shoudy, Matthew, Demarest, James J., Wynne, Jean, Canaperi, Donald, McHerron, Dale, Berger, Dan, Iyer, Subramanian

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3-D Die Stacking With 55 μm Pitch Interconnections on Advanced Ground-Rule Laminate for Artificial Intelligence System by Sakuma, Katsuyuki, Farooq, Mukta, Andry, Paul, Cabral, Cyril, Wassick, Thomas, McHerron, Dale, Divakaruni, Rama

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Next Generation Infrared (IR) Laser Debonding / Silicon Handle Technology for Precision Chiplet Technology Applications by Chen, Qianwen, Belyansky, Michael, Sulehria, Yasir, Horibe, Akihiro, Qin, Liqiao, Pujari, Ruturaj, Perfecto, Eric, Lie, Fee Li, Butt, Shahid, Polomoff, Nick, Miyazawa, Risa, Kohara, Sayuri, Farooq, Mukta, Hisada, Takashi, Oakley, Jennifer, Skordas, Spyridon, Fan, Susan, Sakuma, Katsuyuki, Knickerbocker, John, Mcherron, Dale, Tamura, Takeshi, Ishii, Takayuki, Jaipan, Panupong, Nishimura, Satoshi, Son, Ilseok, Maeda, Yohei, Koga, Takashi, Klein, Joseph, Tashiro, Kei, Arkalgud, Sitaram, Kondo, Yoshihiro

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Apparent reversal of physical ageing in amorphous glassy polymers by electron beam irradiation by McHerron, Dale C, Wilkes, Garth L

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Aggressively Scaled Strained-Silicon-on-Insulator Undoped-Body High- [Formula Omitted]/Metal-Gate nFinFETs for High-Performance Logic Applications by Maitra, Kingsuk, Khakifirooz, Ali, Kulkarni, Pranita, Basker, Veeraraghavan S, Faltermeier, Jonathan, Jagannathan, Hemanth, Adhikari, Hemant, Yeh, Chun-Chen, Klymko, Nancy R, Saenger, Katherine, Standaert, Theodorus, Miller, Robert J, Doris, Bruce, Paruchuri, Vamsi K, McHerron, Dale, O'Neil, James, Leobundung, Effendi, Bu, Huiming

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Heterogeneous Integration on Organic Interposer Substrate with fine-pitch RDL and 40 micron pitch Micro-bumps by Sakuma, Katsuyuki, Bonilla, Griselda, McHerron, Dale, Aoki, Toyohiro, Kastberg, Russell, Pomerantz, Glenn, Bunt, Jay, Wassick, Tom

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DSC analysis of electron-beam irradiated LARC-CPI by Mcherron, Dale C., Wilkes, Garth L.

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Voids-free Die-level Cu/ILD Hybrid bonding by Sakuma, Katsuyuki, Yu, Roy, Polomoff, Nicholas, Darling, Luke, Chowdhury, Promod, Raghavan, Sathya, Seifert, Keodara, Knickerbocker, John, McHerron, Dale, Li, Ming, So, Siu Cheung, Kwok, So Ying, Fan, Chun Ho, Lau, Siu Wing

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3D Die-Stack on Substrate (3D-DSS) Packaging Technology and FEM Analysis for 55\ \mu\mathrm-75\ \mu \mathrm Mixed Pitch Interconnections on High Density Laminate by Sakuma, Katsuyuki, Farooq, Mukta, Andry, Paul, Cabral, Cyril, Rajalingam, Sankeerth, McHerron, Dale, Li, Shidong, Kastberg, Russell, Wassick, Thomas

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Surface Energy Characterization for Die-Level Cu Hybrid Bonding by Sakuma, Katsuyuki, Yu, Roy, Belyansky, Michael, Bergendahl, Marc A, Gomez, Juan-Manuel, Skordas, Spyridon, Knickerbocker, John, McHerron, Dale, Li, Ming, Cheung, Yiu Ming, Cheung So, Siu, Kwok, So Ying, Ho Fan, Chun, Lau, Siu Wing

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Plasma Activated Low-temperature Die-level Direct Bonding with Advanced Wafer Dicing Technologies for 3D Heterogeneous Integration by Sakuma, Katsuyuki, Parekh, Dishit P., Belyansky, Michael, Gomez, Juan-Manuel, Skordas, Spyridon, McHerron, Dale, De Sousa, Isabel, Phaneuf, Marc, Desrochers, Martin M, Li, Ming, Cheung, Yiu Ming, So, Siu Cheung, Kwok, So Ying, Fan, Chun Ho, Lau, Siu Wing

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Functional Testing of AI Cores through Thinned 3D I/O Buffer Dies in 3D Die-Stacked Modules by Farooq, Mukta, Kumar, Arvind, Lee, Sae-Kyu, Bonam, Ravi, Gomez, Juan-Manuel, Kelly, James, Hosokawa, Kohji, Nomura, Akiyo, Kohda, Yasuteru, Dickson, Timothy, Sakuma, Katsuyuki, Mori, Hiroyuki, Rubin, Joshua, Saraf, Iqbal, Pai, Vinay, Nieves, Pablo, Li, Yandong, DelaPena, Abraham, Wassick, Thomas, Perfecto, Eric, Carr, Christopher, Sardesai, Viraj, Miller, Eric, Oakley, Jennifer, Skordas, Spyridon, Teehan, Sean, McHerron, Dale, Burns, Jeff, Divakaruni, Rama

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Novel Materials and Processes in Replacement Metal Gate for Advanced CMOS Technology by Bao, Ruqiang, Hung, Steven, Wang, Miaomiao, Chung, Kisup, Barman, Soumendra, Krishnan, Siddarth A, Yang, Yixiong, Tang, Wei, Li, Luping, Lin, Yongjing, Chan, Michael S, Chen, Zhebo, Miao, Xin, Hopstaken, Marinus, Conti, Richard A, Jagannathan, Hemanth, Chudzik, Michael P, McHerron, Dalea, Haran, Bala S, Natarajan, Sanjay

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Electron beam irradiation of polystyrene-poly(vinyl methyl ether) blends by McHerron, Dale C., Wilkes, Garth L.

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Copper contact metallization for 22 nm and beyond by Soon-Cheon Seo, Chih-Chao Yang, Chun-Chen Yeh, Haran, B., Horak, D., Fan, S., Koburger, C., Canaperi, D., Papa Rao, S.S., Monsieur, F., Knorr, A., Kerber, A., Chao-Kun Hu, Kelly, J., Tuan Vo, Cummings, J., Smalleya, M., Petrillo, K., Mehta, S., Schmitz, S., Levin, T., Dae-Guy Park, Stathis, J.H., Spooner, T., Paruchuri, V., Wynne, J., Edelstein, D., McHerron, D., Doris, B.

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Formation of polymeric microspheres using electron beam radiation by Mcherron, Dale C., Wilkes, Garth L.

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MCM-D/C packaging solution for IBM latest S/390 servers by Perfecto, E.D., Shields, R.R., Malhotra, A.K., Jeanneret, M.P., McHerron, D.C., Katopis, G.A.

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Large Format Fabrication a Practical Approach to Low Cost MCM-D by White, G.E., Perfecto, E., DeMercurio, T., McHerron, D., Redmond, T., Norcott, M.

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Measurement of dielectric anisotropy of BPDA-PDA polyimide in multilayer thin-film packages by Deutsch, A., Swaminathan, M., Ree, M.-H., Surovic, C.W., Arjavalingam, G., Prasad, K., McHerron, D.C., McAllister, M., Kopcsay, G.V., Giri, A.P., Perfecto, E., White, G.E.

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