Search Results - Meda, Abdulmelik H.

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  1. 1
    A Thin and Low-Inductance 1200 V SiC MOSFET Fan-Out Panel-Level Packaging With Thermal Cycling Reliability Evaluation

    A Thin and Low-Inductance 1200 V SiC MOSFET Fan-Out Panel-Level Packaging With Thermal Cycling Reliability Evaluation by Chen, Wei, Jiang, Jing, Meda, Abdulmelik H., Ibrahim, Mesfin S., Zhang, Guoqi, Fan, Jiajie

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  2. 2
    Thermomechanical Oriented Reliability Enhancement of Si MOSFET Panel-Level Packaging Fusing Ant Colony Optimization With Backpropagation Neural Network

    Thermomechanical Oriented Reliability Enhancement of Si MOSFET Panel-Level Packaging Fusing Ant Colony Optimization With Backpropagation Neural Network by Jiang, Jing, Chen, Wei, Qian, Yichen, Meda, Abdulmelik H., Fan, Xuejun, Zhang, Guoqi, Fan, Jiajie

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  3. 3
    Thermo-Mechanical Oriented Reliability Enhancement of Si MOSFET Panel-level Packaging using Ant Colony Optimization with Backpropagation Neural Network

    Thermo-Mechanical Oriented Reliability Enhancement of Si MOSFET Panel-level Packaging using Ant Colony Optimization with Backpropagation Neural Network by Jiang, Jing, Chen, Wei, Qian, Yichen, Meda, Abdulmelik H., Fan, Xuejun, Zhang, Guoqi, Fan, Jiajie

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    Thermal-mechanical-electrical Co-design of Fan-Out Panel-Level SiC MOSFET Packaging with a Multi-objective Optimization Algorithm

    Thermal-mechanical-electrical Co-design of Fan-Out Panel-Level SiC MOSFET Packaging with a Multi-objective Optimization Algorithm by Chen, Wei, Yan, Xuyang, Ibrahim, Mesfin S., Meda, Abdulmelik H., Fan, Xuejun, Zhang, Guoqi, Fan, Jiajie

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