Search Results - Mehul Naik

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  1. 1
    Semiconductor Logic Technology Innovation to Achieve Sub-10 nm Manufacturing

    Semiconductor Logic Technology Innovation to Achieve Sub-10 nm Manufacturing by Schuegraf, K., Abraham, M. C., Brand, A., Naik, M., Thakur, R.

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  2. 2
    Qualitative and quantitative salivary changes and subjective oral dryness among patients with thyroid dysfunction

    Qualitative and quantitative salivary changes and subjective oral dryness among patients with thyroid dysfunction by Naik, Meghal, Vassandacoumara, Vaishnavee

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  3. 3
    Low temperature thermal ALD TaNx and TiNx films from anhydrous N2H4

    Low temperature thermal ALD TaNx and TiNx films from anhydrous N2H4 by Wolf, Steven, Breeden, Michael, Kwak, Iljo, Park, Jun H., Kavrik, Mahmut, Naik, Mehul, Alvarez, Daniel, Spiegelman, Jeffrey, Kummel, Andrew C.

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  4. 4
    Replacement Metal Gate Process Extendible Beyond 2-nm Node with Superior Gate Conductivity

    Replacement Metal Gate Process Extendible Beyond 2-nm Node with Superior Gate Conductivity by Yoshida, Naomi, Fisher, Ilanit, Ren, He, Lin, Chi-Chou, Shen, Chenfei, Lin, Yongjing, Xu, Yi, Chen, Michael S-.C., Naik, Mehul

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  5. 5
    Complementary FET for Advanced Technology Nodes: Where Does It Stand?

    Complementary FET for Advanced Technology Nodes: Where Does It Stand? by Jiang, Liu, Pal, Ashish, Bazizi, El Mehdi, Ren, He, Naik, Mehul, Alexander, Blessy, Ayyagari, Buvna

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  6. 6
    Interconnect Trend for Single Digit Nodes

    Interconnect Trend for Single Digit Nodes by Naik, Mehul

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  7. 7
    Characterization and Multiscale Modeling of TDDB in State-of-the-art BEOL

    Characterization and Multiscale Modeling of TDDB in State-of-the-art BEOL by Palmieri, Andrea, Tavakoli, Mahdi, Ching, Chi, Zheng, Wenkai, You, Shi, Zhang, Xiaodong, Cornigli, Davide, Haverty, Michael, Singh, Navneet, Larcher, Luca, Jamieson, Monika, Bhatnagar, Ajay, Jansen, Alexander, Gage, Max, Tang, Jianshe, Deshpande, Sameer, Brown, Brian, Srivatsa, Arun, Naik, Mehul, Xie, Bo, Gelatos, Jerry, Lee, Joung Joo, Tang, Xianmin, Thareja, Gaurav, Pesic, Milan

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  8. 8
    Resistance Scaling of Cu Interconnect and Alternate Metal (Co, Ru) Benchmark toward sub 10nm Dimension

    Resistance Scaling of Cu Interconnect and Alternate Metal (Co, Ru) Benchmark toward sub 10nm Dimension by Ren, He, Wu, Zhiyuan, Bekiaris, Nikos, Tseng, Jennifer, How, Gary, Xie, Xiangjin, Lei, Wei, Tao, Rong, Shaviv, Roey, Lee, Joung Joo, Vinnakota, Ramkumar, Kashefizadeh, Keyvan, Gage, Max, Naik, Mehul

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  9. 9
    CVD Al/PVD Al integration for advanced via and interconnect technology

    CVD Al/PVD Al integration for advanced via and interconnect technology by Beinglass, Israel, Naik, Mehul

    Published in Thin solid films
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  10. 10
    Image retargeting for wearable devices

    Image retargeting for wearable devices by Bhatt, Jwalant, Pappusetty, Deepti, Kalva, Hari, Naik, Mehul

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  11. 11
    Designing wideband voltage controlled oscillators for Software-Defined Radio

    Designing wideband voltage controlled oscillators for Software-Defined Radio by Naik, Mehul R, Vithalani, C H

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  12. 12
    (Invited) Dielectric Damage

    (Invited) Dielectric Damage by Shohet, J. Leon, Lin, Qinghuang, King, Sean W., Ren, He, Banna, Samer, Jakes, Joseph E., Agasie, Robert J., Naik, Mehul, Nishi, Yoshio, Nichols, Michael T., Mavrakakis, Konstantinos, Hsu, Kaiwen, Guo, Xiangyu, Pei, Dongfei, Li, Weiyi, Choudhury, Faraz, Zheng, Huifeng

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  13. 13
    Design and simulation of X Band microstrip circulator

    Design and simulation of X Band microstrip circulator by Kelaiya, Vishwa, Naik, Mehul R.

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  14. 14
    Novel Hardmask for Sub-20nm Copper/Low K Backend Dual Damascene Integration

    Novel Hardmask for Sub-20nm Copper/Low K Backend Dual Damascene Integration by Xia, Li-Qun, Cui, Zhenjiang, Balseanu, Mihaela, Nguyen, Victor, Zhou, Kevin, Pender, Jeremiah, Naik, Mehul

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  15. 15
    PVD- Treated ALD TaN for Cu Interconnect Extension to 5nm Node and Beyond

    PVD- Treated ALD TaN for Cu Interconnect Extension to 5nm Node and Beyond by Wu, Zhiyuan, Li, Rui, Xie, Xiangjin, Suen, Wesley, Tseng, Jennifer, Bekiaris, Nikos, Vinnakota, Ramkumar, Kashefizadeh, Keyvan, Naik, Mehul

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  16. 16
    Cobalt fill for advanced interconnects

    Cobalt fill for advanced interconnects by Bekiaris, Nikolaos, Zhiyuan Wu, Ren, He, Naik, Mehul, Jin Hee Park, Lee, Mark, Tae Hong Ha, Wenting Hou, Bakke, Jonathan R., Gage, Max, You Wang, Jianshe Tang

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  17. 17
    Selective Barrier for Cu Interconnect Extension in 3nm Node and Beyond

    Selective Barrier for Cu Interconnect Extension in 3nm Node and Beyond by You, Shi, Ren, He, Naik, Mehul, Chen, Lu, Chen, Feng, Cervantes, Carmen Leal, Xie, Xiangjing, Kashefizadeh, Keyvan

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  18. 18
    Integration Challenges for CMP of Copper

    Integration Challenges for CMP of Copper by Bajaj, Rajeev, Zutshi, Ajoy, Surana, Rahul, Naik, Mehul, Pan, Tony

    Published in MRS bulletin
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  19. 19
    Pre-clean Study for Both Damascene SiN and N-Blok to Resolve Queue-time-dependent Dielectric Barrier VBD Degradation

    Pre-clean Study for Both Damascene SiN and N-Blok to Resolve Queue-time-dependent Dielectric Barrier VBD Degradation by Xu, Jerry, Gao, Rong, Wang, Hongjie, Li, Xianyuan, Lee, Sang, Cui, David, Naik, Mehul, Xia, Li-Qun, Xu, Qiang, Zhang, Ziying, Bei, Emily

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  20. 20
    Second Generation Copper Dielectric Barrier (BLOk II): k Reduction and Interface Control To Improve TDDB and EM

    Second Generation Copper Dielectric Barrier (BLOk II): k Reduction and Interface Control To Improve TDDB and EM by Xia, Li-Qun, Zubkov, Vladimir, Ye, Weifeng, Shek, Mei-Yee, Cui, David, Naik, Mehul

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