Search Results - Melamed, Samson

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  1. 1
    Investigation of transient thermal dissipation in thinned LSI for advanced packaging

    Investigation of transient thermal dissipation in thinned LSI for advanced packaging by Araga, Yuuki, Shimamoto, Haruo, Melamed, Samson, Kikuchi, Katsuya, Aoyagi, Masahiro

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  2. 2
    Cool Interconnect: A 1024-bit Wide Bus for Chip-to-Chip Communications in 3-D Integrated Circuits

    Cool Interconnect: A 1024-bit Wide Bus for Chip-to-Chip Communications in 3-D Integrated Circuits by Melamed, Samson, Imura, Fumito, Nakagawa, Hiroshi, Kikuchi, Katsuya, Hagimoto, Michiya, Matsumoto, Yukoh, Aoyagi, Masahiro

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  3. 3
    Thermal impact of extreme die thinning in bump-bonded three-dimensional integrated circuits

    Thermal impact of extreme die thinning in bump-bonded three-dimensional integrated circuits by Melamed, Samson, Watanabe, Naoya, Nemoto, Shunsuke, Shimamoto, Haruo, Kikuchi, Katsuya, Aoyagi, Masahiro

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  4. 4
    Impact of die thinning on the thermal performance of a central TSV bus in a 3D stacked circuit

    Impact of die thinning on the thermal performance of a central TSV bus in a 3D stacked circuit by Melamed, Samson, Imura, Fumito, Nakagawa, Hiroshi, Kikuchi, Katsuya, Hagimoto, Michiya, Matsumoto, Yukoh, Aoyagi, Masahiro

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  5. 5
    Impact of thinning stacked dies on the thermal resistance of bump-bonded three-dimensional integrated circuits

    Impact of thinning stacked dies on the thermal resistance of bump-bonded three-dimensional integrated circuits by Melamed, Samson, Watanabe, Naoya, Nemoto, Shunsuke, Shimamoto, Haruo, Kikuchi, Katsuya, Aoyagi, Masahiro

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  6. 6
    Exploring compromises among timing, power and temperature in three-dimensional integrated circuits

    Exploring compromises among timing, power and temperature in three-dimensional integrated circuits by Hua, Hao, Mineo, Chris, Schoenfliess, Kory, Sule, Ambarish, Melamed, Samson, Jenkal, Ravi, Davis, W. Rhett

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  7. 7
    Junction-Level Thermal Analysis of 3-D Integrated Circuits Using High Definition Power Blurring

    Junction-Level Thermal Analysis of 3-D Integrated Circuits Using High Definition Power Blurring by Melamed, S., Thorolfsson, T., Harris, T. R., Priyadarshi, S., Franzon, P., Steer, M. B., Davis, W. R.

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  8. 8
    Low-Power Hypercube Divided Memory FFT Engine Using 3D Integration

    Low-Power Hypercube Divided Memory FFT Engine Using 3D Integration by Thorolfsson, Thorlindur, Melamed, Samson, Davis, W. Rhett, Franzon, Paul D.

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  9. 9
    Low-Power Hypercube Divided Memory FFT Engine Using 3D Integration

    Low-Power Hypercube Divided Memory FFT Engine Using 3D Integration by Thorolfsson, Thorlindur, Melamed, Samson, Davis, W Rhett, Franzon, Paul D

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  10. 10
    A Transient Electrothermal Analysis of Three-Dimensional Integrated Circuits

    A Transient Electrothermal Analysis of Three-Dimensional Integrated Circuits by Harris, T. R., Priyadarshi, S., Melamed, S., Ortega, C., Manohar, R., Dooley, S. R., Kriplani, N. M., Davis, W. R., Franzon, P. D., Steer, M. B.

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  11. 11
    3D Specific Systems: Design and CAD

    3D Specific Systems: Design and CAD by Franzon, P. D., Davis, W. R., Thorolfsson, T., Melamed, S.

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  12. 12
    Inter-die signaling in three dimensional integrated circuits

    Inter-die signaling in three dimensional integrated circuits by Mineo, C., Jenkal, R., Melamed, S., Davis, W.R.

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  13. 13
    Thermal analysis and verification of a mounted monolithic integrated circuit

    Thermal analysis and verification of a mounted monolithic integrated circuit by Harris, T Robert, Melamed, Samson, Luniya, Sonali, Davis, W Rhett, Steer, Michael B, Doxsee, Lawrence E, Obermiller, Kurt, Hawkinson, Chad

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  14. 14
    Design and CAD for 3D integrated circuits

    Design and CAD for 3D integrated circuits by Franzon, Paul D., Davis, W. Rhett, Steer, Michael B., Lipa, Steve, Oh, Eun Chu, Thorolfsson, Thor, Melamed, Samson, Luniya, Sonali, Doxsee, Tad, Berkeley, Stephen, Shani, Ben, Obermiller, Kurt

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  15. 15
    Compact Electrothermal Modeling of an X-band MMIC

    Compact Electrothermal Modeling of an X-band MMIC by Luniya, S., Batty, W., Caccamesi, V., Garcia, M., Christoffersen, C., Melamed, S., Rhett Davis, W., Steer, M.

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  16. 16
    Junction-level thermal extraction and simulation of 3DICs

    Junction-level thermal extraction and simulation of 3DICs by Melamed, S., Thorolfsson, T., Srinivasan, A., Cheng, E., Franzon, P., Davis, R.

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  17. 17
    Comparative analysis of two 3D integration implementations of a SAR processor

    Comparative analysis of two 3D integration implementations of a SAR processor by Thorolfsson, T., Melamed, S., Charles, G., Franzon, P.D.

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  18. 18
    3D specific systems design and CAD

    3D specific systems design and CAD by Franzon, P. D., Davis, W. R., Thorolfsson, T., Melamed, S.

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  19. 19
    Pathfinder 3D: A flow for system-level design space exploration

    Pathfinder 3D: A flow for system-level design space exploration by Priyadarshi, S., Jianchen Hu, Won Ha Choi, Melamed, S., Xi Chen, Davis, W. R., Franzon, P. D.

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  20. 20
    Performance Trend in Three-Dimensional Integrated Circuits

    Performance Trend in Three-Dimensional Integrated Circuits by Hao Hua, Mineo, C., Schoienfliess, K., Sule, A., Melamed, S., Davis, W.R.

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