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    Design and testing of a kinematic package supporting a 32 x 32 array of GaAs MQW modulators flip-chip bonded to a CMOS chip

    Design and testing of a kinematic package supporting a 32 x 32 array of GaAs MQW modulators flip-chip bonded to a CMOS chip by AYLIFFE, Michael H, ROLSTON, David R, CHUAH, Alan E. L, BERNIER, Eric, MICHAEL, Feras S. J, KABAL, David, KIRK, Andrew G, PLANT, David V

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    Design and testing of a kinematic package supporting a 3232 array of GaAs MQW modulators flip-chip bonded to a CMOS chip

    Design and testing of a kinematic package supporting a 3232 array of GaAs MQW modulators flip-chip bonded to a CMOS chip by Ayliffe, M H, Rolston, DR, Chuah, AEL, Bernier, E, Michael, FSJ, Kabal, D, Kirk, A G, Plant, D V

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