AstroLibrary: A library for real-time conjunction assessment and optimal collision avoidance by Choi, Shawn SH, Ryu, Peter JH, Sim, Kyuil, Seong, Jaedong, Song, Jae Wook, Mah, Misoon, Kim, Douglas DS

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High temperature characteristics of GaAs MESFET devices fabricated with AlAs buffer layer by Lee, R., Trombley, G., Johnson, B., Reston, R., Misoon Mah, Havasy, C., Ito, C.

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Three dimensional transmission lines and special elements design by Darwish, A., Ezzeddine, A., Huang, H.C., Misoon Mah, Cook, J., Bumman, K., Lim Joonyoul, Yu Sungwhan

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Design methodology of microstrip lines using dimensional analysis by Mah, M.Y., Liou, L.L., Ewing, R.L., Ferendeci, A.M.

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3D multilayer monolithic microwave (M/sup 3/) passive transmitter module by Ferendeci, A.M., Bosui Liu, Ho Huang, Mah, M., Lee Liou

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Three dimensional power amplifier and special elements design by Darwish, A., Ezzeddine, A., Huang, H.C., Mah, M.

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Interlayer MEMS RF switch for 3D MMICS by Wang, Y.A., Qinghua Kang, Bosui Liu, Ferendeci, A.M., Mah, M.

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Effective dielectric constant of the embedded transmission line (ETL)-a multilayer stripline-like structure by Darwish, A., Ezzeddine, A., Huang, H.C., Mah, M.

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Study of Cryogenic Plasma in Superfluid Liquid Helium by Mah, Misoon Y, Ishihara, Osamu

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Properties of the embedded transmission line (ETL)-an offset stripline with two dielectrics by Darwish, A., Ezzeddine, A., Huang, H.C., Mah, M.

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Vertically interconnected 3D module for conformal phased array antennas by Bosui Liu, Wang, Y.A., Kang, G., Ferendeci, A.M., Misoon Mah

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Analysis of three-dimensional embedded transmission lines (ETL's) by Darwish, A., Ezzeddine, A., Huang, H.C., Mah, M.

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Inexpensive X-band 1/2 watt PA using 3D LTCC technology by Darwish, A., Ezzeddine, A., Mah, M., Cook, J.

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