Search Results - Miyatani, Kotaro

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  1. 1
    Robust Ultralow-$k$ Dielectric (Fluorocarbon) Deposition by Microwave Plasma-Enhanced Chemical Vapor Deposition

    Robust Ultralow-$k$ Dielectric (Fluorocarbon) Deposition by Microwave Plasma-Enhanced Chemical Vapor Deposition by Kikuchi, Yoshiyuki, Miyatani, Kotaro, Kobayashi, Yasuo, Kawamura, Kohei, Nemoto, Takenao, Nakamura, Masahiro, Matsumoto, Hirokazu, Ito, Azumi, Shirotori, Akihide, Nozawa, Toshihisa, Matsuoka, Takaaki

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  2. 2
    Electrical Characteristics of Novel Non-porous Low-$k$ Dielectric Fluorocarbon on Cu Interconnects for 22 nm Generation and Beyond

    Electrical Characteristics of Novel Non-porous Low-$k$ Dielectric Fluorocarbon on Cu Interconnects for 22 nm Generation and Beyond by Gu, Xun, Nemoto, Takenao, Tomita, Yugo, Shirotori, Akihide, Miyatani, Kotaro, Saito, Akane, Kobayashi, Yasuo, Teramoto, Akinobu, Kuroki, Shin-Ichiro, Nozawa, Toshihisa, Matsuoka, Takaaki, Sugawa, Shigetoshi, Ohmi, Tadahiro

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  3. 3
    Robust Ultralow- k Dielectric (Fluorocarbon) Deposition by Microwave Plasma-Enhanced Chemical Vapor Deposition

    Robust Ultralow- k Dielectric (Fluorocarbon) Deposition by Microwave Plasma-Enhanced Chemical Vapor Deposition by Kikuchi, Yoshiyuki, Miyatani, Kotaro, Kobayashi, Yasuo, Kawamura, Kohei, Nemoto, Takenao, Nakamura, Masahiro, Matsumoto, Hirokazu, Ito, Azumi, Shirotori, Akihide, Nozawa, Toshihisa, Matsuoka, Takaaki

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  4. 4
    Integration Process Development for Improved Compatibility with Organic Non-Porous Ultralow-$k$ Dielectric Fluorocarbon on Advanced Cu Interconnects

    Integration Process Development for Improved Compatibility with Organic Non-Porous Ultralow-$k$ Dielectric Fluorocarbon on Advanced Cu Interconnects by Gu, Xun, Tomita, Yugo, Nemoto, Takenao, Miyatani, Kotaro, Saito, Akane, Kobayashi, Yasuo, Teramoto, Akinobu, Kuroda, Rihito, Kuroki, Shin-Ichiro, Kawase, Kazumasa, Nozawa, Toshihisa, Matsuoka, Takaaki, Sugawa, Shigetoshi, Ohmi, Tadahiro

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  5. 5
    Integration Process Development for Improved Compatibility with Organic Non-Porous Ultralow- k Dielectric Fluorocarbon on Advanced Cu Interconnects

    Integration Process Development for Improved Compatibility with Organic Non-Porous Ultralow- k Dielectric Fluorocarbon on Advanced Cu Interconnects by Gu, Xun, Tomita, Yugo, Nemoto, Takenao, Miyatani, Kotaro, Saito, Akane, Kobayashi, Yasuo, Teramoto, Akinobu, Kuroda, Rihito, Kuroki, Shin-Ichiro, Kawase, Kazumasa, Nozawa, Toshihisa, Matsuoka, Takaaki, Sugawa, Shigetoshi, Ohmi, Tadahiro

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  6. 6
    Electrical Characteristics of Novel Non-porous Low- k Dielectric Fluorocarbon on Cu Interconnects for 22 nm Generation and Beyond

    Electrical Characteristics of Novel Non-porous Low- k Dielectric Fluorocarbon on Cu Interconnects for 22 nm Generation and Beyond by Gu, Xun, Nemoto, Takenao, Tomita, Yugo, Shirotori, Akihide, Miyatani, Kotaro, Saito, Akane, Kobayashi, Yasuo, Teramoto, Akinobu, Kuroki, Shin-Ichiro, Nozawa, Toshihisa, Matsuoka, Takaaki, Sugawa, Shigetoshi, Ohmi, Tadahiro

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  7. 7
    Deposition of diamond-like carbon film in CH4-He r.f. plasma

    Deposition of diamond-like carbon film in CH4-He r.f. plasma by MUTSUKURA, N, MIYATANI, K

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  8. 8
    Induction of interdigitating reticulum cell-like differentiation in human monocytic leukemia cells by conditioned medium from IL-2-stimulated helper T-cells

    Induction of interdigitating reticulum cell-like differentiation in human monocytic leukemia cells by conditioned medium from IL-2-stimulated helper T-cells by TAKAHASHI, K, MIYATANI, K, YANAI, H, JEON, H. J, FUJIWARA, K, YOSHINO, T, HAYASHI, K, AKAGI, T, MIZOBUCHI, K

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