Enhancing the resistance of low- k hydrogen silsesquioxane (HSQ) to wet stripper damage by Chang, T.C., Mor, Y.S., Liu, P.T., Tsai, T.M., Chen, C.W., Mei, Y.J., Sze, S.M.

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Critical Process Features Enabling Aggressive Contacted Gate Pitch Scaling for 3nm CMOS Technology and Beyond by Chang, Chih-Hao, Chang, V.S., Pan, K.H., Lai, K.T., Lu, J. H., Ng, J.A., Chen, C.Y., Wu, B.F., Lin, C.J., Liang, C.S., Tsao, C.P., Mor, Y.S., Li, C.T., Lin, T.C., Hsieh, C.H., Chen, P.N., Hsu, H.H., Chen, J.H., Chen, H.F., Yeh, J.Y., Chiang, M.C., Lin, C.Y., Liaw, J.J., Wang, C.H., Lee, S.B., Chen, C.C., Lin, H.J., Chen, R., Chen, K.W., Chui, C.O., Yeo, Y.C., Huang, K.B., Lee, T.L., Tsai, M.H., Chen, K.S., Lu, Y.C., Jang, S.M., Wu, S.-Y.

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The effect of ammonia plasma treatment on low- k methyl-hybrido-silsesquioxane against photoresist stripping damage by Chang, T.C, Mor, Y.S, Liu, P.T, Tsai, T.M, Chen, C.W, Mei, Y.J, Sze, S.M

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The novel pattern method of low- k hybrid-organic-siloxane-polymer film using X-ray exposure by Chang, T.C, Tsai, T.M, Liu, P.T, Mor, Y.S, Chen, C.W, Mei, Y.J, Sheu, J.T, Tseng, T.Y

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Improvement of low dielectric constant methylsilsesquioxane by boron implantation treatment by Chang, T.C, Mor, Y.S, Liu, P.T, Tsai, T.M, Chen, C.W, Sze, S.M, Mei, Y.J

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Preventing dielectric damage of low-k organic siloxane by passivation treatment by Chang, T.C., Mor, Y.S., Liu, P.T., Tsai, T.M., Chen, C.W., Mei, Y.J., Pan, F.M., Wu, W.F., Sze, S.M.

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The novel precleaning treatment for selective tungsten chemical vapor deposition by Chang, T.C, Mor, Y.S, Liu, P.T, Sze, S.M, Yang, Y.L, Tsai, M.S, Chang, C.Y

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Knee osteoarthritis patients demonstrate improved gait and reduced pain following a home-based biomechanical therapy. A multi-centre study on Singapore population by Elbaz, A, Mor, A, Segal, G, Aloni, Y, Teo, Y.H, Teo, Y.S, Das-De, S, Fruchter, G, Yeo, S.J

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