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A PCB-Embedded 1.2 kV SiC MOSFET Package with Reduced Manufacturing Complexity
by
Knoll, Jack
,
DiMarino, Christina
,
Stahr, Hannes
,
Morianz, Mike
Published in
IEEE open journal of power electronics
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A PCB-Embedded 1.2 kV SiC MOSFET Half-Bridge Package for a 22 kW AC-DC Converter
by
Knoll, Jack S.
,
Son, Gibong
,
DiMarino, Christina
,
Li, Qiang
,
Stahr, Hannes
,
Morianz, Mike
Published in
IEEE transactions on power electronics
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Design and Analysis of a PCB-Embedded 1.2 kV SiC Half-Bridge Module
by
Knoll, Jack
,
Son, Gibong
,
DiMarino, Christina
,
Li, Qiang
,
Stahr, Hannes
,
Morianz, Mike
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Simulation of stress distribution in assembled silicon dies and deflection of printed circuit boards
by
Macurova, Katerina
,
Angerer, Paul
,
Schöngrundner, Ronald
,
Krivec, Thomas
,
Morianz, Mike
,
Antretter, Thomas
,
Bermejo, Raul
,
Pletz, Martin
,
Brizoux, Michel
,
Maia, Wilson
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Numerical investigation of the process of embedding components into Printed Circuit Boards
by
Pletz, Martin
,
Bermejo, Raul
,
Supancic, Peter
,
Stahr, Johannes
,
Morianz, Mike
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Local strength measurement technique for miniaturised silicon-based components
by
Deluca, Marco
,
Bermejo, Raul
,
Pletz, Martin
,
Morianz, Mike
,
Stahr, Johannes
,
Supancic, Peter
,
Danzer, Robert
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Multi-physics simulation of the component attachment within embedding process
by
Macurova, K.
,
Kharicha, A.
,
Pletz, M.
,
Mataln, M.
,
Bermejo, R.
,
Schongrundner, R.
,
Krivec, T.
,
Antretter, T.
,
Maia, W.
,
Morianz, M.
,
Brizoux, M.
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