Stress impact of moisture diffusion measured with the stress chip by Schindler-Saefkow, F., Rost, F., Otto, A., Pantou, R., Mroßko, R., Wunderle, B., Michel, B., Rzepka, S., Keller, J.

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Effect of moisture swelling on MEMS packaging and integrated sensors by Keller, J., Mrossko, R., Dobrinski, H., Stürmann, J., Döring, R., Dudek, R., Rzepka, S., Michel, B.

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Thermal management of electrical overload cases using thermo-electric modules and phase change buffer techniques: Simulation, technology and testing by Springborn, M., Wunderle, B., May, D., Mrossko, R., Manier, C.-A, Oppermann, H., Ras, M. Abo, Mitova, R.

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Stress impact of moisture diffusion measured with the stress chip by Schindler-Saefkow, F., Rost, F., Otto, A., Pantou, R., Mrossko, R., Wunderle, B., Michel, B., Rzepka, S., Keller, J.

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3-D thin chip integration technology - from technology development to application by Fritzsch, T., Mrossko, R., Baumgartner, T., Toepper, M., Klein, M., Wolf, J., Wunderle, B., Reichl, H.

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Advances in thermal interface technology: mono-metal interconnect formation, processing and characterisation by Wunderle, B, Klein, M, Dietrich, L, Ras, M Abo, Mrossko, R, May, D, Schacht, R, Oppermann, H, Michel, B, Reichl, H

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Mechanical characterisation of thin metal layers by modelling of the nanoindentation experiment by Wittler, O., Mrossko, R., Kaulfersch, E., Wunderle, B., Michel, B.

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Numerical approach to extraction of elasto-plastic material models and corresponding properties of thin layers through nanoindentation technique by Wymyslowski, Artur, Wittler, O., Mrossko, R., Dudek, Rainer, Auersperg, Juergen, Dowhan, Lukasz

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Characterisation and modelling of the nanoindentation experiment in Au layers by Wittler, O., Mrossko, R., Huber, S., Gollhardt, A., Michel, B.

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In-situ measurement of various thin bond-line-thickness thermal interface materials with correlation to structural features by Wunderle, B., Kleff, J., Mrossko, R., Abo Ras, M., May, D., Schacht, R., Oppermann, H., Keller, J., Michel, B.

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Progress in thermal characterisation methods and thermal interface technology within the "Nanopack" project by Wunderle, B., Ras, M.A., Klein, M., Mrossko, R., Engelmann, G., May, D., Wittler, O., Schacht, R., Dietrich, L., Oppermann, H., Michel, B.

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Nano-particle enhanced encapsulants for improved humidity resistance by Braun, T., Hausel, F., Bauer, J., Wittier, O., Mrossko, R., Bouazza, M., Becker, K.-F., Oestermann, U., Koch, M., Bader, V., Minge, C., Aschenbrenner, R., Reichl, H.

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