Search Results - Mustain, Habib

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  1. 1
    Transient Liquid Phase Die Attach for High-Temperature Silicon Carbide Power Devices

    Transient Liquid Phase Die Attach for High-Temperature Silicon Carbide Power Devices by Mustain, H A, Brown, W D, Ang, S S

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  2. 2
    Thermo-Mechanical Characterization of Au-In Transient Liquid Phase Bonding Die-Attach

    Thermo-Mechanical Characterization of Au-In Transient Liquid Phase Bonding Die-Attach by Grummel, B. J., Shen, Z. J., Mustain, H. A., Hefner, A. R.

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  3. 3
    Reliability Characterization of Au-In Transient Liquid Phase Bonding Through Electrical Resistivity Measurement

    Reliability Characterization of Au-In Transient Liquid Phase Bonding Through Electrical Resistivity Measurement by Grummel, Brian J., Mustain, Habib A., Zheng John Shen, Elmes, John C., Hefner, Allen R.

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  4. 4
    SiC power device reliability

    SiC power device reliability by Gajewski, Donald A., Hull, Brett, Lichtenwalner, Daniel J., Sei-Hyung Ryu, Bonelli, Eric, Mustain, Habib, Gangyao Wang, Allen, Scott T., Palmour, John W.

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  5. 5
    Reliability study of Au-In transient liquid phase bonding for SiC power semiconductor packaging

    Reliability study of Au-In transient liquid phase bonding for SiC power semiconductor packaging by Grummel, B., Mustain, H. A., Shen, Z. J., Hefner, A. R.

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  6. 6
    Evaluation of gold and aluminum wire bond performance for high temperature (500 /spl deg/C) silicon carbide (SiC) power modules

    Evaluation of gold and aluminum wire bond performance for high temperature (500 /spl deg/C) silicon carbide (SiC) power modules by Mustain, H.A., Lostetter, A.B., Brown, W.D.

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