Search Results - Nachiappan, V.C.

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    Electrical behavior of Au–Ge eutectic solder under aging for solder bump application in high temperature Electronics

    Electrical behavior of Au–Ge eutectic solder under aging for solder bump application in high temperature Electronics by Lau, F.L., I Made, Riko, Putra, W.N., Lim, J.Z., Nachiappan, V.C., Aw, J.L., Gan, C.L.

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