Search Results - Nagano, Fuya

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  1. 1
    Characterization of bonding activation sequences to enable ultra-low Cu/SiCN wafer level hybrid bonding

    Characterization of bonding activation sequences to enable ultra-low Cu/SiCN wafer level hybrid bonding by Iacovo, Serena, Peng, Lan, Nagano, Fuya, Uhrmann, Thomas, Burggraf, Jurgen, Fehkuhrer, Andreas, Conard, Thierry, Inoue, Fumihiro, Kim, Soon-Wook, De Vos, Joeri, Phommahaxay, Alain, Beyne, Eric

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  2. 2
    Characterization of Silicon Carbon Nitride for Low Temperature Wafer-to-Wafer Direct Bonding

    Characterization of Silicon Carbon Nitride for Low Temperature Wafer-to-Wafer Direct Bonding by Nagano, Fuya, Iacovo, Serena, Phommahaxay, Alain, Inoue, Fumihiro, Sleeckx, Erik, De Gendt, Stefan, Beyer, Gerald, Beyne, Eric

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  3. 3
    Direct Bonding Using Low Temperature SiCN Dielectrics

    Direct Bonding Using Low Temperature SiCN Dielectrics by Iacovo, Serena, Nagano, Fuya, Channam, Venkat Sunil Kumar, Walsby, Edward, Crook, Kath, Buchanan, Keith, Jourdain, Anne, Vanstreels, Kris, Phommahaxay, Alain, Beyne, Eric

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  4. 4
    Growth rate of IMC in the binary sytems of Co/Sn and Cu/Sn

    Growth rate of IMC in the binary sytems of Co/Sn and Cu/Sn by Nagano, Fuya, Kajihara, Masanori, Derakhshandeh, Jaber, Hou, Lin, Van De Peer, Myriam, De Preter, Inge, Sharifi, Shamin Houshmand, Rebibis, Kenneth June, Miller, Andy, Beyer, Gerald, Beyne, Eric

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    3D stacking cobalt and nickel microbumps and kinetics of corresponding IMCs at low temperatures

    3D stacking cobalt and nickel microbumps and kinetics of corresponding IMCs at low temperatures by De Preter, Inge, Derakhshandeh, Jaber, Nagano, Fuya, Sharifi, Shamin Houshmand, Hou, Lin, Bex, Pieter, Suhard, Samuel, Shibata, Toshiaki, Oda, Yukinori, Hashimoto, Shigeo, Lieten, Ruben, Rebibis, Kenneth June, Miller, Andy, Beyer, Gerald, Beyne, Eric

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