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Search Results - Nah, Chih Kai
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Use of microwave technology for rapid cure of chip-on-board glob top encapsulants
by
Wei, J.B.
,
Fathi, Z.
,
Binghua Pan
,
Chih Kai Nah
,
Su Liang Chan
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Enhanced Imager Chip Packaging for Automotive Applications
by
Troxell, John R.
,
Burns, Jeff H.
,
Chaudhuri, A. K.
,
Pan, Binghua
,
Nah, Chih Kai
,
Teo, Kiat Choon
,
Ihms, David
,
Fox, Stephen
,
Garner, Timothy
,
Bauson, William A.
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Enhanced imager chip packaging for automotive applications: Journal of passenger cars: electronic and electrical systems
by
TROXELL, John R
,
BURNS, Jeff H
,
CHAUDHURI, A. K
,
BINGHUA PAN
,
CHIH KAI NAH
,
KIAT CHOON TEO
,
IHMS, David
,
FOX, Stephen
,
GARNER, Timothy
,
BAUSON, William A
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Enhanced Imager Chip Packaging for Automotive Applications
by
Troxell, John R
,
Burns, Jeff H
,
Chaudhuri, A. K
,
Pan, Binghua
,
Nah, Chih Kai
,
Teo, Kiat Choon
,
Ihms, David
,
Fox, Stephen
,
Garner, Timothy
,
Bauson, William A
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Mechanism of electromigration-induced failure in flip-chip solder joints with a 10-μm-thick Cu under-bump metallization
by
Nah, Jae-Woong
,
Chen, Kai
,
Tu, K.N.
,
Su, Bor-Rung
,
Chen, Chih
Published in
Journal of materials research
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Mechanism of electromigration-induced failure in flip-chip solder joints with a 10-Dmm-thick Cu under-bump metallization
by
Nah, Jae-Woong
,
Chen, Kai
,
Tu, K N
,
Su, Bor-Rung
,
Chen, Chih
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Journal of materials research
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