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Search Results - Narasimman, T. Sathya
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Link Peek: A Link Outage Resilient IP Packet Forwarding Mechanism for 6LoWPAN/RPL Based Low-Power and Lossy Networks (LLNs)
by
Lohith, Y. S.
,
Narasimman, T. Sathya
,
Anand, S. V. R.
,
Hedge, Malati
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Process Development and Performance Benefits of 0.64-0.36 μm Pitch Hybrid Bonding on Intel Process
by
Talukdar, Tushar
,
Elsherbini, Adel
,
Rawlings, Brandon
,
Vreeland, Richard
,
Brezinski, William
,
Dong, Siyan
,
Niazi, Haris Khan
,
Liu, Pilin
,
Shi, Yi
,
Tabassum, Natasha
,
Sathe, Ajay
,
Ajayi, Taiwo
,
Bedoya, Felipe
,
Tiagaraj, Sathya Narasimman
,
Pasdast, Gerald
,
Jun, Kimin
,
Brun, Xavier
,
Swan, Johanna
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3D Packaging
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6Lowpan
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Bonded Joints
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Contikios
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Delays
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Dielectrics
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Electronic Components
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Hybrid Bonding
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Hybrid Power Systems
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Iot
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Ip Forwarding
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Links
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Materials Science
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Materials Science, Multidisciplinary
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Message Reliabilty
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Ieee Electronic Library (Iel) Conference Proceedings
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Ieee Xplore All Conference Series
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