Challenges in introducing high-density interconnect technology in printed circuit boards for space applications by Cauwe, Maarten, Vandevelde, Bart, Nawghane, Chinmay, Van De Slyeke, Marnix, Coulon, Alexia, Heltzel, Stan

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A Hybrid Model for Prognostic and Health Management of Electronic Devices by Murgia, Alessandro, Harsha, Chaitra, Tsiporkova, Elena, Nawghane, Chinmay, Vandevelde, Bart

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Molecular detection of SARS-COV-2 in exhaled breath at the point-of-need by Stakenborg, Tim, Raymenants, Joren, Taher, Ahmed, Marchal, Elisabeth, Verbruggen, Bert, Roth, Sophie, Jones, Ben, Yurt, Abdul, Duthoo, Wout, Bombeke, Klaas, Fauvart, Maarten, Verplanken, Julien, Wiederkehr, Rodrigo S, Humbert, Aurelie, Dang, Chi, Vlassaks, Evi, Jáuregui Uribe, Alejandra L, Luo, Zhenxiang, Liu, Chengxun, Zinoviev, Kirill, Labie, Riet, Frederiks, Aduen Darriba, Saldien, Jelle, Covens, Kris, Berden, Pieter, Schreurs, Bert, Van Duppen, Joost, Hanifa, Rabea, Beuscart, Megane, Pham, Van, Emmen, Erik, Dewagtere, Annelien, Lin, Ziduo, Peca, Marco, El Jerrari, Youssef, Nawghane, Chinmay, Arnett, Chad, Lambrechts, Andy, Deshpande, Paru, Lagrou, Katrien, De Munter, Paul, André, Emmanuel, Van den Wijngaert, Nik, Peumans, Peter

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NimbleAI: Towards Neuromorphic Sensing-Processing 3D-integrated Chips by Iturbe, Xabier, Abderrahmane, Nassim, Abella, Jaume, Alcaide, Sergi, Beyne, Eric, Charles, Henri-Pierre, Charpin-Nicolle, Christelle, Chittka, Lars, Davila, Angelica, Erdmann, Arne, Estrada, Carles, Fernandez, Ander, Fontanelli, Anna, Flich, Jose, Furano, Gianluca, Gloriani, Alejandro Hernan, Isusquiza, Erik, Grosu, Radu, Hernandez, Carles, Ielmini, Daniele, Jackson, David, Kooli, Maha, Lepri, Nicola, Linares-Barranco, Bernabe, Lachese, Jean-Loup, Laurent, Eric, Lindwer, Menno, Linsenmaier, Frank, Lujan, Mikel, Masarik, Karel, Mentens, Nele, Moreira, Orlando, Nawghane, Chinmay, Peres, Luca, Noel, Jean-Philippe, Pourtaherian, Arash, Posch, Christoph, Priller, Peter, Prikryl, Zdenek, Resch, Felix, Rhodes, Oliver, Stefanov, Todor, Storring, Moritz, Taliercio, Michele, Tornero, Rafael, van de Burgwal, Marcel, van der Plas, Geert, Vianello, Elisa, Zaykov, Pavel

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Effect of potting on the solder joint reliability of QFN packages under thermal cycling load by Nawghane, Chinmay, Vandevelde, Bart, Vanderstraeten, Daniel, Haspeslagh, Harold, Nauwelaerts, Thomas

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Deformation analysis of QFN packages for validation of thermo-mechanical finite element simulations by Nawghane, Chinmay, Moncond'Huy, Thomas, Vandevelde, Bart, Vernhes, Pierre, Cruz, Rodolfo

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BGA electromigration behavior and why it has become the bottleneck by Labie, Riet, Nawghane, Chinmay, Tsiakos, Dimitrios, Mertens, Jan, Tremble, Eric, Graf, Richard, Sauter, Wolfgang

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