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Critical solder joint in insulated gate bipolar transistors (IGBT) power module for improved mechanical reliability
by
Nebo, Sunday E.
,
Amalu, Emeka H.
,
Hughes, David J.
Published in
Microelectronic engineering
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Engineering
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Insulated Gate Bipolar Transistors
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Plastic Strain And Strain Energy Density
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Power Electronics
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Power Electronics Design
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Solder Joints Alloy Materials
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Thermal And Power Cycles. Stress
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