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Thermal and thermo-mechanical modelling of polymer overmoulded electronics
by
Sarvar, Farhad
,
Whalley, David C
,
Hutt, David A
,
Palmer, Paul J
,
Joo Teh, Nee
Published in
Microelectronics international
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Overmoulding of Electronics for End of Life Recovery
by
Hutt, D.A.
,
Nee Joo Teh
,
Sarvar, F.
,
Whalley, D.C.
,
Palmer, P.J.
,
Anderson, P.
,
Kandasubramanian, B.
,
Morris, P.
,
Prosser, S.
,
O'Brien, P.
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Thermal and thermomechanical modelling of polymer overmoulded electronics
by
Sarvar, Farhad
,
Whalley, David C.
,
Hutt, David A.
,
Palmer, Paul J.
,
Joo Teh, Nee
Published in
Microelectronics international
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Article
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Direct polymeric encapsulation of electronic systems for automotive applications
by
Nee-Joo Teh
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Dissertation
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Overmoulding of electronics for end of life recovery
by
David Hutt
,
Nee-Joo Teh
,
Farhad Sarvar
,
David Whalley
,
Paul Palmer
,
Paul Anderson
,
Balasubramanian Kandasubramanian
,
Peter Morris
,
Stephen Prosser
,
Phillip O'Brien
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Conference Proceeding
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Thermo-mechanical modelling of polymer encapsulated electronics
by
Farhad Sarvar
,
Nee-Joo Teh
,
David Whalley
,
David Hutt
,
Paul Palmer
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Microelectronics International
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Mechanical Engineering Not Elsewhere Classified
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Design. Technologies. Operation Analysis. Testing
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Encapsulation
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Loughborough University Institutional Repository Open Access
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