Search Results - Neffati, Mehdy

  • Showing 1 - 3 results of 3
Refine Results
  1. 1
    Moisture absorption and desorption in epoxy mould compounds: Characterization of Fickian and non-Fickian behaviours in complex packages

    Moisture absorption and desorption in epoxy mould compounds: Characterization of Fickian and non-Fickian behaviours in complex packages by Tomas, Ariane, Frémont, Hélène, Malbert, Nathalie, Neffati, Mehdy, Lambert, Benoit

    Get full text
    Items that this one cites
    Article
    Save to List
    Saved in:
  2. 2
    Reliability of Fan-Out Wafer Level Packaging For III-V RF Power MMICs

    Reliability of Fan-Out Wafer Level Packaging For III-V RF Power MMICs by Tomas, Ariane, Marechal, Laurent, Almeida, Rodrigo, Neffati, Mehdy, Malbert, Nathalie, Fremont, Helene, Labat, Nathalie, Garnier, Arnaud

    Request full text
    Conference Proceeding
    Save to List
    Saved in:
  3. 3
    System in package embedding III-V chips by fan-out wafer-level packaging for RF applications

    System in package embedding III-V chips by fan-out wafer-level packaging for RF applications by Garnier, Arnaud, Castagne, Laetitia, Greco, Florent, Guillemet, Thomas, Marechal, Laurent, Neffati, Mehdy, Franiatte, Remi, Coudrain, Perceval, Piotrowicz, Stephane, Simon, Gilles

    Request full text
    Conference Proceeding
    Save to List
    Saved in:

Search Tools: