'Riskscapes' and risk management - Review and synthesis of an actor-network theory approach by Neisser, Florian M.

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The effect of ceramic surface treatment on bonding to densely sintered alumina ceramic by Valandro, Luiz Felipe, Della Bona, Alvaro, Antonio Bottino, Marco, Neisser, Maximiliano Piero

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Effect of the surface treatment of plain carbon fiber posts on the retention of the composite core: an in vitro evaluation by Quintas, A F, Bottino, M A, Neisser, M P, de Araújo, M A

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Shear bond strengths of a ceramic system to alternative metal alloys by de Melo, Renata Marques, Travassos, Alessandro Caldas, Neisser, Maximiliano Piero

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High-performance glass-ceramic/copper multilayer substrate with thin-film redistribution by Tummala, R. R., Knickerbocker, J. U., Knickerbocker, S. H., Herron, L. W., Nufer, R. W., Master, R. N., Neisser, M. O., Kellner, B. M., Perry, C. H., Humenik, J. N., Redmond, T. F.

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Optimization of resolution-enhanced photolithography for a 256Mb DRAM cell by Ferguson, R, Ausschnitt, C, Chang, I, Farrell, T, Hashimoto, K, Liebmann, L, Martino, R, Maurer, W, Mii, T, Moy, D, Neisser, M, Nunes, R, Samuels, D, Weed, J

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Lithography system evolution: a perspective on a methodology for the rapid determination of 0.25um process capability by Weed, J. T., Ferguson, R. A., Liebmann, L. W., Martino, K. M., Molless, A. F., Neisser, M. O.

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Effect of resist surface characteristics on film-pulling velocity in immersion lithography by Schuetter, S., Shedd, T., Nellis, G., Romano, A., Dammel, R., Padmanaban, M., Houlihan, F., Krawicz, A., Lin, G., Rahman, D., Chakrapani, S., Neisser, M., Van Peski, C.

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Spin-on Trilayer Approaches to High NA 193nm Lithography by Abdallah, D. J., Mckenzie, D., Timko, A., Dioses, A., Houlihan, F., Rahman, D., Miyazaki, S., Zhang, R., Kim, W., Wu, H., Pylneva, L., Lu, P-H., Nisser, M., Dammel, R. R.

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Stereospecific reactions of dichloroketene with vinyl sulfoxides: a new type of polar cycloaddition by Marino, J. P, Neisser, Mark

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Measurable Problems by Neisser, Marianne

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Applying a thin imaging resist system to substrates with topography by Neisser, M, Grozev, G, Maenhoudt, M, Lepage, M, Struyf, H

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Deep-UV Lithographic Approaches For 1 Gb DRAM by Wong, Farrell, Ferguson, Lut, Mansfield, Molless, Neisser, Nunes, Samuels, Thomas

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LITHOGRAPHY SYSTEM EVOLUTION by T. Weed, J, A. Ferguson, R, W. Liebmann, L, M. Martino, K, F. Molless, A, O. Neisser, M

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LITHOGRAPHY SYSTEM EVOLUTION: A PERSPECTIVE ON A METHODOLOGY FOR THE RAPID DETERMINATION OF O.25um PROCESS CAPABILITY by Weed, J. T., Ferguson, R. A., Liebmann, L. W., Martino, K. M., Molless, A. F., Neisser, M. O.

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High-performance glass-ceramic/copper multilayer substrate with thin-film redistribution: ES/9000 semiconductor and packaging technologies by TUMMALA, R. R, KNICKERBOCKER, J. U, REDMOND, T. F, KNICKERBOCKER, S. H, HERRON, L. W, NUFER, R. W, MASTER, R. N, NEISSER, M. O, KELLNER, B. M, PERRY, C. H, HUMENIK, J. N

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Die negative Phase der Antikörperkurve in theoretischer Beleuchtung by Neisser, M.

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Einiges über angewandte Bakteriologie by Neisser, M.

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Infrared Activated Signatures and Jahn–Teller Dynamics of NO–CH4 Collision Complexes by Davis, John P., Neisser, Ruby W., Kidwell, Nathanael M.

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Infrared Activated Signatures and Jahn-Teller Dynamics of NO-CH 4 Collision Complexes by Davis, John P, Neisser, Ruby W, Kidwell, Nathanael M

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