Detachable Optical Chiplet Connector for Co-Packaged Photonics by Psaila, Nicholas, Nekkanty, Srikant, Shia, David, Tadayon, Pooya

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Liquid Metal Interconnects for High Pin Count Scaling and Socketing Applications by Nekkanty, Srikant, Meyyappan, Karumbu, Mondal, Saikat, Tadayon, Pooya

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Co-Packaged Photonics For High Performance Computing: Status, Challenges And Opportunities by Mahajan, Ravi, Li, Xiaoqian, Fryman, Joshua, Zhang, Zhichao, Nekkanty, Srikant, Tadayon, Pooya, Jaussi, James, Shumarayev, Sergey, Agrawal, Ankur, Jadhav, Susheel, Singh, Kumar Abhishek, Alduino, Andrew, Gujjula, Sushrutha, Chiu, Chia-Pin, Nordstog, Thomas, Hosseini, Kaveh J., Sane, Sandeep, Deshpande, Nitin, Aygun, Kemal, Sarkar, Arnab, Dobriyal, Priyanka, Pothukuchi, Suresh, Pogue, Vanessa, Hui, David

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Gallium‐Based Liquid‐Metal Alloys: Challenges and Risk Management in High‐Humidity Environments by Meyyappan, Karumbu, Arrington, Kyle, Tadayon, Pooya, Murtagian, Gregorio, Lin, Ziyin, Ouvarov‐Bancalero, Valery, Tran, Donald, Nekkanty, Srikant

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Liquid Metal based Low Resistance Interconnect Technology by Meyyappan, Karumbu, Tadayon, Pooya, Murtagian, Gregorio, Nekkanty, Srikant, Ouvarov-Bancalero, Valery, Lin, Ziyin, Lu, Xiao

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Digital tomosynthesis (DTS) for quantitative assessment of trabecular microstructure in human vertebral bone by Kim, Woong, Oravec, Daniel, Nekkanty, Srikant, Yerramshetty, Janardhan, Sander, Edward A, Divine, George W, Flynn, Michael J, Yeni, Yener N

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Optimizing Thin Film Tool Coatings Using a Finite Element Computer Simulator by Draguljić, Danel, Nekkanty, Srikant, Santner, Thomas, Dean, Angela, Shivpuri, Rajiv

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Stiffness of the endplate boundary layer and endplate surface topography are associated with brittleness of human whole vertebral bodies by Nekkanty, Srikant, Yerramshetty, Janardhan, Kim, Do-Gyoon, Zauel, Roger, Johnson, Evan, Cody, Dianna D, Yeni, Yener N

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A cohesive zone finite element approach to model tensile cracks in thin film coatings by Nekkanty, Srikant, Walter, Mark, Shivpuri, Rajiv

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CPU Socket Interposer Component Level and PCBA Manufacturability Study and Part 2: iNEMI 2023 Board Assembly - CPU Socket Technology Roadmap by Wang, Paul, Feng, Top, Wang, Rocky, Dandia, Sanjay, Liang, Changwei, Nekkanty, Srikant, Szu, Simon, Dai, Homer, Bath, Jasbir

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Indentation damage to boron carbide–DLC coatings with different compositions by Nekkanty, Srikant, Walter, Mark E.

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