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  1. 1
    Solid-State Tetramer vs. Solution-State Dimer. Reinvestigation of [Ag2(OAc)2(dppm)]2 and Its dppm Addition Product [Ag(OAc)(dppm)]2 (dppm = Ph2PCH2PPh2)

    Solid-State Tetramer vs. Solution-State Dimer. Reinvestigation of [Ag2(OAc)2(dppm)]2 and Its dppm Addition Product [Ag(OAc)(dppm)]2 (dppm = Ph2PCH2PPh2) by Neo, Soh Ping, Zhou, Zhong-Yuan, Mak, Thomas C. W, Hor, T. S. Andy

    Published in Inorganic chemistry
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  2. 2
    A Demonstration on the Effectiveness of Wafer-level Thermal Microscopy as A Complementary Tool to Photon Emission Microscopy Using MBIST Failure Debug

    A Demonstration on the Effectiveness of Wafer-level Thermal Microscopy as A Complementary Tool to Photon Emission Microscopy Using MBIST Failure Debug by Yeoh, BL, Goh, SH, Thor, MH, Hao, Hu, Tan, Alan, Chan, YH, Lin, Zhao, Neo, SP, Lam, Jeffrey, Chua, CM, Tan, SH

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  3. 3
    Diagnosis and failure analysis for scan failure

    Diagnosis and failure analysis for scan failure by Song, Z.G., Neo, S.P., Tun, T., Oh, C.K., Lo, K.F.

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  4. 4
    Copper corrosion issue and analysis on copper damascene process

    Copper corrosion issue and analysis on copper damascene process by Song, Z.G., Neo, S.P., Oh, C.K., Redkar, S., Lee, Y.P.

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  5. 5
    A new paradigm of using TEM in yield enhancement failure analysis for sub-micron integrated circuit devices

    A new paradigm of using TEM in yield enhancement failure analysis for sub-micron integrated circuit devices by Oh, C.K., Song, Z.G., Neo, S.P., Ang, G.B., Magdeliza, G., Redkar, S.

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  6. 6
    Promotion of tetrahedral copper( I ) dimers by chelation of 1,1′-bis(diphenylphosphino)ferrocene (dppf). Crystal structures of [{CU(µ-X)(dppf-P,P′)} 2 ](X = O 2 CH, I or NO 3 )

    Promotion of tetrahedral copper( I ) dimers by chelation of 1,1′-bis(diphenylphosphino)ferrocene (dppf). Crystal structures of [{CU(µ-X)(dppf-P,P′)} 2 ](X = O 2 CH, I or NO 3 )... by Neo, Soh Ping, Zhou, Zhong-Yuan, Mak, Thomas C. W., Hor, T. S. Andy

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  7. 7
    Copper corrosion issue and analysis on copper damascene process

    Copper corrosion issue and analysis on copper damascene process by Zhigang Song, Soh Ping Neo, Chong Khiam Oh, Redkar, S., Yuan-Ping Lee

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