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Search Results - Nguyen, P.H.L.
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Anaerobic digestion of municipal solid waste as a treatment prior to landfill
by
Nguyen, P.H.L.
,
Kuruparan, P.
,
Visvanathan, C.
Published in
Bioresource technology
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The evolution of multi-level air gap integration towards 32 nm node interconnects
by
Daamen, R.
,
Bancken, P.H.L.
,
Nguyen, V.H.
,
Humbert, A.
,
Verheijden, G.J.A.M.
,
Hoofman, R.J.O.M.
Published in
Microelectronic engineering
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Advanced Cu interconnects using air gaps
by
Gosset, L.G.
,
Farcy, A.
,
de Pontcharra, J.
,
Lyan, Ph
,
Daamen, R.
,
Verheijden, G.J.A.M.
,
Arnal, V.
,
Gaillard, F.
,
Bouchu, D.
,
Bancken, P.H.L.
,
Vandeweyer, T.
,
Michelon, J.
,
Hoang, V. Nguyen
,
Hoofman, R.J.O.M.
,
Torres, J.
Published in
Microelectronic engineering
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Reliability Characterization of Different Pore Sealing Techniques on Porous Silk Dielectric Films
by
Michelon, J.
,
Waeterloos, J.
,
Bancken, P.H.L.
,
Nguyen, V.H.
,
Caluwaerts, R.
,
Beyer, G.
,
Rozeveld, S.
,
Beach, E.
,
Hoofman, R.J.O.M.
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Multi-Level Air Gap Integration for 32/22nm nodes using a Spin-on Thermal Degradable Polymer and a SiOC CVD Hard Mask
by
Daamen, R.
,
Bancken, P.H.L.
,
Emur Badaroglu, D.
,
Michelon, J.
,
Nguyen, V.H.
,
Verheijden, G.J.A.M.
,
Humbert, A.
,
Waeterloos, J.
,
Yang, A.
,
Cheng, J.K.
,
Chen, L.
,
Martens, T.
,
Hoofman, R.J.O.M.
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Air gap integration for the 45nm node and beyond
by
Daamen, R.
,
Verheijden, G.J.A.M.
,
Bancken, P.H.L.
,
Vandeweyer, T.
,
Michelon, J.
,
Nguyen Hoang, V.
,
Hoofman, R.J.O.M.
,
Gallagher, M.K.
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Conference Proceeding
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