Search Results - Ni Dheasuna, C.

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  1. 1
    Electroless copper metallisation of titanium nitride

    Electroless copper metallisation of titanium nitride by Patterson, J.C., Ni Dheasuna, C., Barrett, J., Spalding, T.R., O'Reilly, M., Jiang, X., Crean, G.M.

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  2. 2
    Investigation of the oxidation behaviour of thin film and bulk copper

    Investigation of the oxidation behaviour of thin film and bulk copper by O'Reilly, M., Jiang, X., Beechinor, J.T., Lynch, S., NíDheasuna, C., Patterson, J.C., Crean, G.M.

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  3. 3
    Copper Metallisation of Barrier Materials

    Copper Metallisation of Barrier Materials by Patterson, J. C., Dheasuna, C. Ni, Barrett, J.

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    Novel buried contact technology for advanced silicon solar cells

    Novel buried contact technology for advanced silicon solar cells by Dheasuna, C.N., Mathewson, A., Hecking, L., Wrixon, G.T.

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