Search Results - Nowodzinski, Antoine

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  1. 1
    1/f Noise Characterization of Piezoresistive Nano-Gauges for MEMS Sensors

    1/f Noise Characterization of Piezoresistive Nano-Gauges for MEMS Sensors by Nowodzinski, Antoine, Ahmed, Dihia Sidi, Theodorou, Christoforos, Kournela, Alexandra, Duchemin, Helene, Dressler, Cyril, Berthelot, Audrey, Lhermer, Helene

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  2. 2
    EFM study of injected charges in the silicon nitride of an electrostatic actuated MEMS

    EFM study of injected charges in the silicon nitride of an electrostatic actuated MEMS by Antoine, N, Didier, B, Adam, K, Thibaut, T

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  3. 3
    Nitrogen-Vacancy Centers in Diamond for Current Imaging at the Redistributive Layer Level of Integrated Circuits

    Nitrogen-Vacancy Centers in Diamond for Current Imaging at the Redistributive Layer Level of Integrated Circuits by Nowodzinski, Antoine, Chipaux, Mayeul, Toraille, Loïc, Vincent, Jacques, Roch, Jean-François, Debuisschert, Thierry

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  4. 4
    Failure analysis of a 2.5D stacking using μinsert technology

    Failure analysis of a 2.5D stacking using μinsert technology by Nowodzinski, Antoine, Mandrillon, Vincent, Bouchu, David, Franiatte, Remi, Boutry, Herve, Bloch, Didier, Rousseau, Karine, Lionel, Chevalier

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  5. 5
    Reliability tests on micro-insert die bonding technology

    Reliability tests on micro-insert die bonding technology by Nowodzinski, A., Boutry, H., Franiatte, R., Mandrillon, V., Anciant, R., Verrun, S., Simon, G.

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    Reliability Characterization of Ni-based Microinsert Interconnections for Flip Chip Die on Wafer Attachment and Their Evaluation in Multichip SIMCARD Prototype

    Reliability Characterization of Ni-based Microinsert Interconnections for Flip Chip Die on Wafer Attachment and Their Evaluation in Multichip SIMCARD Prototype by Boutry, H., Souriau, J.-C., Brun, J., Franiatte, R., Nowodzinski, A., Sillon, N., Dubois-Bonvalot, B., Depoutot, F., Brunet, O., Peytavy, A.

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