Search Results - Nurmi, S.T

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    The influence of multiple reflow cycles on solder joint voids for lead-free PBGAs

    The influence of multiple reflow cycles on solder joint voids for lead-free PBGAs by Nurmi, S.T, Sundelin, J.J, Ristolainen, E.O, Lepistö, T

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  2. 2
    The influence of multiple reflow cycles on solder joint voids for leadfree PBGAs

    The influence of multiple reflow cycles on solder joint voids for leadfree PBGAs by Nurmi, S.T., Sundelin, J.J., Ristolainen, E.O., Lepist, T.

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    Pull testing of lead-free QFP solder joints

    Pull testing of lead-free QFP solder joints by Sundelin, J.J., Nurmi, S.T., Lepisto, T.K., Ristolainen, E.O.

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