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Search Results - Nurulakmal, MS
Search Results - Nurulakmal, MS
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Effect of iron and indium on IMC formation and mechanical properties of lead-free solder
by
Fallahi, H.
,
Nurulakmal, M.S.
,
Arezodar, A. Fallahi
,
Abdullah, Jamaluddin
Published in
Materials science & engineering. A, Structural materials : properties, microstructure and processing
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Microstructure, wettability and strength of cryo‐deformed tin‐3.0silver‐0.5copper solder
by
Nurulakmal, MS
,
Koay, T S
Published in
Materialwissenschaft und Werkstofftechnik
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Effect of Al addition to bulk microstructure, IMC formation, wetting and mechanical properties of low-Ag SAC solder
by
Maslinda, K.
,
Anasyida, A. S.
,
Nurulakmal, M. S.
Published in
Journal of materials science. Materials in electronics
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Preliminary Study on Potential of EAF Slag as Nutrients Source for Mangrove Seedling
by
Kong, Ern Hun
,
Nurulakmal, M.S.
Published in
Journal of physics. Conference series
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Wetting characterization of Flip chip's Lead-Free Solder Interconnect Using Surface Evolver
by
Lim, S.F.
,
Nurulakmal, M.S.
Published in
Journal of physics. Conference series
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Influence of Grain Refinement via ECAP to the Corrosion Behaviour of SAC 305 Solder
by
Nur Adriana Nazifa, A.B.
,
Tuti Katrina, A.
,
Nurulakmal, M.S.
Published in
Journal of physics. Conference series
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Modifying the mechanical properties of lead-free solder by adding iron and indium and using a lap joint test
by
Fallahi, H.
,
Nurulakmal, M. S.
,
Fallahi, A.
,
Abdullah, Jamaluddin
Published in
Journal of materials science. Materials in electronics
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The effect of space holder content and decomposition methods in fabrication of aluminum foams by powder metallurgy method using carbamide space holder
by
Amirah, A. H.
,
Nurulakmal, M. S.
,
Anasyida, A. S.
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Conference Proceeding
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